Amazon.com: Silicon Micromachining (Cambridge Studies in Semiconductor Physics and Microelectronic Engineering) (9780521590549): M. Elwenspoek, H. V. Jansen: Books

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Silicon Micromachining (Cambridge Studies in Semiconductor Physics and Microelectronic Engineering)
 
 
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Silicon Micromachining (Cambridge Studies in Semiconductor Physics and Microelectronic Engineering) [Hardcover]

M. Elwenspoek (Author), H. V. Jansen (Author)


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Book Description

May 13, 1999 052159054X 978-0521590549
This comprehensive book provides an overview of the key techniques used in the fabrication of micron-scale structures in silicon. Recent advances in these techniques have made it possible to create a new generation of microsystem devices, such as microsensors, accelerometers, micropumps, and miniature robots. The authors underpin the discussion of each technique with a brief review of the fundamental physical and chemical principles involved. They pay particular attention to methods such as isotropic and anisotropic wet chemical etching, wafer bonding, reactive ion etching, and surface micromachining. There is a special section on bulk micromachining, and the authors also discuss release mechanisms for movable microstructures. The book is a blend of detailed experimental and theoretical material, and will be of great interest to graduate students and researchers in electrical engineering and materials science whose work involves the study of micro-electromechanical systems (MEMS).

Editorial Reviews

Review

'This book has many admirable properties. It covers the chosen subject in considerable detail and brings together much of the state-of-the-art. The illustrations and photographs are of very high quality and indeed the whole book is well presented. It will be useful to both the experienced engineer wishing to sort out a few problems in his own work and to those requiring an introduction to silicon microengineering' R. A. Lawes, Engineering Science and Education Journal

Book Description

This comprehensive book provides an overview of the key techniques used in the fabrication of micron-scale structures in silicon. It is a blend of detailed experimental and theoretical material, and will be of great interest to graduate students and researchers in electrical engineering and materials science whose work involves the study of micro-electromechanical systems (MEMS).

Product Details

  • Hardcover: 420 pages
  • Publisher: Cambridge University Press (May 13, 1999)
  • Language: English
  • ISBN-10: 052159054X
  • ISBN-13: 978-0521590549
  • Product Dimensions: 10 x 7 x 1.4 inches
  • Shipping Weight: 2.2 pounds
  • Amazon Best Sellers Rank: #3,552,075 in Books (See Top 100 in Books)

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Inside This Book (learn more)
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First Sentence:
Etching and bonding of silicon are basic technologies in micro systems technology (MST). Read the first page
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
microelectromechanical systems, film deposition, thin film processes, assisted radical etching, ratio trench etching, wagon wheel method, time etch stop, plasma glow region, ion shadowing, target platen, image force theory, remote plasma etching, image force mechanism, etch rate minimum, etch directionality, underetch rate, sacrificial layer etching, anisotropic wet chemical etching, etch stop mechanisms, etch apparatus, anisotropic etching solutions, hydrophobic wafers, bottling effect, ion deflection, radical depletion
Key Phrases - Capitalized Phrases (CAPs): (learn more)
Crystal Growth, San Diego, The Netherlands, San Francisco, Micro Electro Mechanical Systems, Electrochem Soc, University of Twente, First Law, Academic Press, New York, Hilton Head Island, Third Law, Second Law, Physical Chemistry, Plasma Techniques, Salt Lake City, Napa Valley, Uppsala University, John Wiley, Electron Devices, Thin Solid Films, Park Ridge, Monte Carlo, New Jersey, North Holland
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Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
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