This text explores the field of microscale heat transfer in mechanical engineering. Experts from a wide range of science and engineering disciplines present topics that are built from simple macroscopic concepts and gradually lead into microscopic concepts. The book begins with an introductory chapter which discusses the history and the future directions of microscale heat transfer. It is then divided into two sections: the Fundamentals and the Applications.
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Inside This Book
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First Sentence:
Recent trends in science and technology have indicated an increasing emphasis on miniaturization of engineering systems and study of microscale phenomena. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
micro heat pipes, heat pipe array, diffuse mismatch model, maximum heat transport capacity, directional solidification stage, maximum wafer temperature, microscale regime, microscale energy transport, conventional heat pipes, heat pipe concept, semiconductor devices and interconnects, intrinsic meniscus, extended meniscus, minimum thermal conductivity, contact line region, evaporator region, hyperbolic heat equation, fabricated microstructures, particle transport theories, pipe arrays, microscale heat transfer, plain wafer, capillary limit, evaporating meniscus, phonon heat capacity Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Monte Carlo, Electron Dev, Sensors Actuators, Heat Mass Transfer, Isothermal Contour Plot, Academic Press, Colloid Interface Sci, International Heat Pipe Conference, International Conference, Oxford University Press, Phase Rule, Predicted Data, Digest of Technical Papers, John Wiley, University of California, American Institute of Chemical Engineers, Experimental Data Maximum Temp, Marcel Dekker, Plenum Press, San Diego, Thermal Sci, Von Arx, Combining Eqs, Damgaard Kristensen New!
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Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Recent trends in science and technology have indicated an increasing emphasis on miniaturization of engineering systems and study of microscale phenomena. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
micro heat pipes, heat pipe array, diffuse mismatch model, maximum heat transport capacity, directional solidification stage, maximum wafer temperature, microscale regime, microscale energy transport, conventional heat pipes, heat pipe concept, semiconductor devices and interconnects, intrinsic meniscus, extended meniscus, minimum thermal conductivity, contact line region, evaporator region, hyperbolic heat equation, fabricated microstructures, particle transport theories, pipe arrays, microscale heat transfer, plain wafer, capillary limit, evaporating meniscus, phonon heat capacity Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Monte Carlo, Electron Dev, Sensors Actuators, Heat Mass Transfer, Isothermal Contour Plot, Academic Press, Colloid Interface Sci, International Heat Pipe Conference, International Conference, Oxford University Press, Phase Rule, Predicted Data, Digest of Technical Papers, John Wiley, University of California, American Institute of Chemical Engineers, Experimental Data Maximum Temp, Marcel Dekker, Plenum Press, San Diego, Thermal Sci, Von Arx, Combining Eqs, Damgaard Kristensen New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 59
books:
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1
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cites this book:
- Solid State Physics: Advances in Research and Applications, Vol. 32 by Henry Ehrenreich on 5 pages
- Introduction to Solid State Physics by Charles Kittel on page 94, page 145, and page 291
- Psychiatric Nursing by Holly Skodol Wilson on page 146, page 225, and page 289
- Physics of Semiconductor Devices by Simon M. Sze on page 94, and page 292
- Semiconductor Devices: Solutions Manual: Physics and Technology by Simon M. Sze on page 94, and page 292
See all 59 books this book cites
- Advances in Heat Transfer, Volume 33 by James P. Hartnett ? on page 285, and page 294
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