Bonding in Microsystem Technology (Springer Series in Advanced Microelectronics) [Hardcover]

Jan A. Dziuban (Author)

Book Description

Publication Date: July 26, 2006 | ISBN-10: 1402045786 | ISBN-13: 978-1402045783 | Edition: 1

This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.

Editorial Reviews

Review

From the reviews: "Any one interested in bonding in microsystem technology will likely be well served by this outstanding volume which is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. … Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students." (Current Engineering Practice, 2007)

Product Details

• Hardcover: 349 pages
• Publisher: Springer; 1 edition (July 26, 2006)
• Language: English
• ISBN-10: 1402045786
• ISBN-13: 978-1402045783
• Product Dimensions: 9.5 x 6.3 x 0.8 inches
• Shipping Weight: 1.2 pounds (View shipping rates and policies)
• Amazon Best Sellers Rank: #2,707,418 in Books (See Top 100 in Books)

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