Microvias: For Low Cost, High Density Interconnects [Hardcover]

John H. Lau (Author), S.W. Ricky Lee (Author)

Book Description

ISBN-10: 0071363270 | ISBN-13: 978-0071363273 | Publication Date: April 26, 2001 | Edition: 1

State-of-the-art introduction to high-density interconnect technology

The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that’s changing the nature of printed circuit boards--and driving the mobile electronic revolution. A "must" for electronics and mechanical engineers, John Lau and Ricky Lee’s intensive introduction to microvia technology expertly covers all major techniques. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, K&S (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba.

Editorial Reviews

From the Back Cover

The first comprehensive and in-depth guide to microvia and wafer level chip scale package (WLCSP) technologies. This reference gives you cutting edge information on the most important developments and latest research results in applying the microvia and WLCSP technologies to low-cost and high-density interconnects. For professionals active in microvia and WLCSP research and development, those who wish to master microvia and WLCSP problem solving methods, and those demanding a cost-effective design and high-yield manufacturing process for their low-cost and high-density interconnect systems, here is up-to-the-minute coverage of all aspects of this fascinating field.

This one-stop guide meets the reference needs of design, materials, process, equipment, manufacturing, reliability, component, packaging, marketing, and system engineers, and technical managers working in electronic packaging and interconnection. With this book you will develop a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of microvia and WLCSP technologies. Among the topics explored:
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*IC trends and their packaging technology updates
*Design, materials, imaging, drilling, plating, etching, solder resist, machining, and routing of conventional PCB technologies
*Mechanical drilling for microvias
*Materials, mechanisms, tools, and processes for making microvias with Excimer, UC:YAG, and CO2 laser drilling
*Microvias formed by various photoimageable dielectrics and fine-line lithography
*Chemical- and plasma-etched microvias
*Conductive paste/ink-filled microvias
*Thin-film high-density interconnects for WLCSP applications
*Solders for the next generation of WLCSPs
*Creep of solders under combined loads
*Low-alpha-particle-bearing solders
*Lead-free solders
*Wafer bumping (by electroplating and stencil printing methods) with lead-free solders
*Assembly of flip chip on high-density PCBs or substrates with reworkable underfills and with no-flow underfills
*Solder-joint reliability of WLCSP on microvia build-up or substrates

Microvias: For Low-Cost and High-Density Interconnects is required reading for the electronic packaging industry. Page after page, this standard-setting guide gives you both essential technical details and an eye-opening overview of this fast-developing field. No matter how you use this book, you will see why it is the resource of choice for the field's leaders.

About the Author

John H. Lau (Palo Alto, CA) is the President of Express Packaging Systems, Inc. He is the author of nine previous technical books and teaches throughout the world. Ricky S. Lee (Hong Kong, China) is a Professor of Electrical Engineering at the University of Hong Kong.

Product Details

• Hardcover: 565 pages
• Publisher: McGraw-Hill Professional; 1 edition (April 26, 2001)
• Language: English
• ISBN-10: 0071363270
• ISBN-13: 978-0071363273
• Product Dimensions: 9.3 x 6.4 x 1.8 inches
• Shipping Weight: 2.7 pounds
• Average Customer Review: 5.0 out of 5 stars  See all reviews (2 customer reviews)
• Amazon Best Sellers Rank: #1,304,507 in Books (See Top 100 in Books)

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Customer Reviews

Most Helpful Customer Reviews

5.0 out of 5 stars Useful overview of topics, July 25, 2001

By 

K.L. Jim - See all my reviews

This review is from: Microvias: For Low Cost, High Density Interconnects (Hardcover)

This book gives an excellent review of microvias and WLCSP technologies, with real-world examples from the electronic packaging industry. It focuses largely on how to create effective & reliable low-cost, high density interconnects in modern high speed system designs. It provides a sufficient amount of theory so that the the reader can understand the fundamental issues assosiated with high density interconnection. It's a comprehensive book with the ability to keep you satisfied no matter what you are looking for.

0 of 2 people found the following review helpful:

5.0 out of 5 stars Useful overview of topics, July 25, 2001

By 

K.L. Jim - See all my reviews

This review is from: Microvias: For Low Cost, High Density Interconnects (Hardcover)

This book gives an excellent review of microvias and WLCSP technologies, with real-world examples from the electronic packaging industry. It focuses largely on how to create effective & reliable low-cost, high density interconnects in modern high speed system designs. It provides a sufficient amount of theory so that the the reader can understand the fundamental issues assosiated with high density interconnection. It's a comprehensive book with the ability to keep you satisfied no matter what you are looking for.