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5.0 out of 5 stars
Useful overview of topics,
This review is from: Microvias: For Low Cost, High Density Interconnects (Hardcover)
This book gives an excellent review of microvias and WLCSP technologies, with real-world examples from the electronic packaging industry. It focuses largely on how to create effective & reliable low-cost, high density interconnects in modern high speed system designs. It provides a sufficient amount of theory so that the the reader can understand the fundamental issues assosiated with high density interconnection. It's a comprehensive book with the ability to keep you satisfied no matter what you are looking for.
0 of 2 people found the following review helpful:
5.0 out of 5 stars
Useful overview of topics,
This review is from: Microvias: For Low Cost, High Density Interconnects (Hardcover)
This book gives an excellent review of microvias and WLCSP technologies, with real-world examples from the electronic packaging industry. It focuses largely on how to create effective & reliable low-cost, high density interconnects in modern high speed system designs. It provides a sufficient amount of theory so that the the reader can understand the fundamental issues assosiated with high density interconnection. It's a comprehensive book with the ability to keep you satisfied no matter what you are looking for.
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Microvias: For Low Cost, High Density Interconnects by John H. Lau (Hardcover - April 26, 2001)
Used & New from: $61.75
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