Modern Electroplating, 4th Edition [Hardcover]

Mordechay Schlesinger (Editor), Milan Paunovic (Editor)

Book Description

ISBN-10: 0471168246 | ISBN-13: 978-0471168249 | Publication Date: August 10, 2000 | Edition: 4

A new collection of authoritative contributions on the state of the art of electrochemical deposition
Since the last edition of Modern Electroplating was published over a quarter century ago, electrochemical deposition has evolved into a mature science, with many new and potential applications. To address these developments, Modern Electroplating, Fourth Edition presents an entirely new collection of contributions on a wide range of cutting-edge topics, from electrodeposition of semiconductors to environmental considerations.
Geared to experienced deposition practitioners and novices alike, the new edition provides clear, thorough, up-to-date explanations of the principles and applications of highly relevant deposition techniques. It not only replaces the Third Edition, a very useful resource on electroplating processes, but, in addition, highlights the transition in the electronics industry from physical to electrochemical methods, especially with regard to next-generation technologies such as copper interconnect. Coverage includes:
* Electrodeposition of various metals and metal alloys
* Electrodeposition of semiconductors and electrodeposition on nonconductors
* Electrodeposition of conductive polymers
* Electroless deposition of various metals and alloys
* Preparation procedures for deposition
* Manufacturing technologies, monitoring, testing, and control
* Deposition and the environment

Editorial Reviews

Review

"...an excellent reference source for numerous plating methods." (IEEE Electrical Insulation Magazine, 2002)

From the Back Cover

A new collection of authoritative contributions on the state of the art of electrochemical deposition

Since the last edition of Modern Electroplating was published over a quarter century ago, electrochemical deposition has evolved into a mature science, with many new and potential applications. To address these developments, Modern Electroplating, Fourth Edition presents an entirely new collection of contributions on a wide range of cutting-edge topics, from electrodeposition of semiconductors to environmental considerations.

Geared to experienced deposition practitioners and novices alike, the new edition provides clear, thorough, up-to-date explanations of the principles and applications of highly relevant deposition techniques. It not only replaces the Third Edition, a very useful resource on electroplating processes, but, in addition, highlights the transition in the electronics industry from physical to electrochemical methods, especially with regard to next-generation technologies such as copper interconnect. Coverage includes:
* Electrodeposition of various metals and metal alloys
* Electrodeposition of semiconductors and electrodeposition on nonconductors
* Electrodeposition of conductive polymers
* Electroless deposition of various metals and alloys
* Preparation procedures for deposition
* Manufacturing technologies, monitoring, testing, and control
* Deposition and the environment

See all Editorial Reviews

Product Details

• Hardcover: 888 pages
• Publisher: Wiley-Interscience; 4 edition (August 10, 2000)
• Language: English
• ISBN-10: 0471168246
• ISBN-13: 978-0471168249
• Product Dimensions: 10.1 x 7 x 1.5 inches
• Shipping Weight: 3.4 pounds
• Average Customer Review: 4.5 out of 5 stars  See all reviews (2 customer reviews)
• Amazon Best Sellers Rank: #1,816,758 in Books (See Top 100 in Books)

Customer Reviews

Most Helpful Customer Reviews

6 of 6 people found the following review helpful:

4.0 out of 5 stars Excellent Review of Electroplating. Editing needs work., June 3, 2007

By 

Thomas E. Dinan (San Jose, CA United States) - See all my reviews
(REAL NAME)   

This review is from: Modern Electroplating, 4th Edition (Hardcover)

I have read through about a third of this book in an effort to update my electroplating knowledge and learn about some areas of electroplating I don't normally practice.

Generally speaking, this is an excellent review of the field and has been updated to include information on additive use in copper electroplating and developments in alloy electroplating for electronics.

On the downside, the editing of the book as a whole seems to be non-existent. The quality of individual chapters varies widely. This leaves me with the impression that Schlesinger and Paunovic only checked to see if the chapters were written in English and stopped at that point. Some chapters are a delight to read (like the chapter on palladium) while others are peppered with typographical errors, missing equations and such like things (e.g. the chapter on chromium). Also the varying values of Faraday's constant throughout the book indicates that no effort was made to enforce consistency of constants and units throughout the book. I was so irritated by this that I spent two or three hours finding out exactly what Faraday's constant should be (it's 96,485.3 Coulombs/mole). I found a good explanation of Faraday's constant on [...]

4 of 18 people found the following review helpful:

5.0 out of 5 stars Plating, June 9, 2001

By 

Samula (Bandung,West java, Indonesia) - See all my reviews

This review is from: Modern Electroplating, 4th Edition (Hardcover)

This a good book because I can get so much technology of elektroplating in this book, especially the solution of plating that this book give.