From the Back Cover
The definitive guide to the fastest-growing segment of packaging and interconnect technology Multichip Module Technology Handbook At a time when demands for greater speed and performance are taxing the limits of traditional packaging techniques, multichip modules (MCMs) have clearly emerged as the solution to providing high-density interconnect capability and enhanced design flexibility. Endorsed by the International Microelectronics and Packaging Society (IMAPS), this much-needed handbook features such international recognized contributors as Rao Tummala, Christian Val, and Barry Gilbert, and it offers complete guidance on how to develop, design, manufacture, test, and market MCM technology. Up to date and packed with more than 600 illustrations, the handbook: Defines MCM classifications and compares MCMs to non-MCM technology; Highlights the electrical performance advantages of MCM technology; Discusses state-of-the-art ceramic, deposited, and laminate MCMs and assesses their relative advantages and limitations; Focuses on the application of MCMs to a wide spectrum of industry design problems. Including in-depth coverage of 3D packaging, module-to board interconnection, and thermal issues, Multichip Module Technology Handbook will be a major catalyst in the development of advanced electronic systems that are faster, hotter, and more reliable than those built with stand-alone ICs.