Surface mount technology (SMT) revolutionized the electronic packaging field in the 80s. Now - while many manufacturers are still rushing to retool for SMT - three new technologies are taking the industry by storm: multichip module (MCM), tape automated bonding (TAB), and chip on board (COB) packaging. Capable of producing results that are 50% lighter, 50% smaller, and 50% cheaper than SMT, these leading-edge technologies are bound to have an enormous impact on a broad spectrum of applications - from aerospace and communications to advanced computer and control technologies. Providing complete coverage of all design and manufacturing issues as well as end-product applications, this book shows how to take part in the packaging revolution of the 90s.
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