Design and Test for Multiple Gbps Communication Devices and Systems (Design Handbook series) [Paperback]

Mike Peng Li PhD (Editor)

Book Description

Publication Date: November 1, 2005 | ISBN-10: 1931695342 | ISBN-13: 978-1931695343

Focusing on the latest communication technologies, methods, and applications that can differentiate products and services, this book covers the essential elements of device and system development and shows how companies can deliver faster service without compromising quality.

Editorial Reviews

Review

This book deals with the latest and outstanding practical physical layer issues and solutions of high speed communication systems. Widely ranging topics in different disciplines such as Tx/Rx architecture, EM-modeling, entire-path simulation, system level jitter transfer modeling, jitter measurement with model-based inversion, etc. are discussed in a orderly and comprehensive manner. Readers will benefit a lot from Dr Li's superior effort and vision on integrating these topics in a single book with a clear and coherent logical flow. --Masashi Shimanouchi, Sr Staff Engineer, Credence Systems

Design and test for multiple Gbps are two tightly coupled subjects and this book by Dr. Li brings readers the latest and systematical overview of technologies and innovations in these two and other relevant fields. I give my highest remark for this book not only because of the importance of the subject and contents presented, but also its unique, start-of-art, latest, in depth, quantitative and thorough treatments for design and test at Gbps rates --William Baldwin, Sr Staff Engineer, Sun Microsystems

Difficult, knotty, intractable problems attract determined, unflagging, and very, very practical individuals like the hardy band of high-speed adventurers Mike Li has brought together in this extraordinary volume. If you are planning a multi-gigabit project, or you just built one and it doesn't work, listen to the voices in this book--the voices of experience --Howard Johnson, author of "High-Speed Digital Design, a Handbook of Black Magic", chief technical editor of standards for Fast and Gigabit Ethernet, and Signal Integrity columnist for EDN magazine

About the Author

Dr. Mike Peng Li is currently the Chief Technology Officer of Wavecrest Corporation. Dr. Li pioneered a jitter separation method (Tailfit) and DJ, RJ, and TJ concept and theory formation, as well as the jitter family-tree classification scheme that is now widely used in academia and industry. He also pioneered and advocated the statistical system transfer function approach for jitter and noise modeling and analysis that has now become the mainstream and necessary design and test method for multiple Gbps links, I/O buses, and networks. Dr. Li is involved in setting, and has contributed to, standards for jitter, noise, and signal integrity for leading serial data communications means such as Fibre Channel, Gigabit Ethernet, Serial ATA, PCI Express, FB DIMM, and International Technology Roadmap for Semiconductors (ITRS) test technology. Currently, he is Co-Chairman of the PCI Express Jitter Standard Committee. Dr. Li also sits on the technical committees of the IEEE's International Test Conference (ITC) and the IEC's DesignCon conference and is a speaker on the subjects of jitter/noise and signal integrity, covering both design and test. Dr. Li has more than 15 years of experience with high-speed measurement instrumentation, testing, and analysis/modeling algorithms/tools, with applications in IC, microprocessor, clock, and serial data communications for electrical, optical, and wireless communication. He is experienced in working on measurement systems, ATE architectures, hardware, software, performance, and accuracy. Dr Li has a B.S. in physics from the University of Science and Technology of China, an M.S.E. in electrical engineering, and a Ph.D. in physics from University of Alabama in Huntsville. He did his post-doctorate work at the University of California - Berkeley as a research scientist in high-energy astrophysics. Dr Li has published more than 70 papers in refereed technical journals and conference proceedings and has filed 10 patents, with two granted and eight pending.

Product Details

• Paperback: 497 pages
• Publisher: International Engineering Consortium (November 1, 2005)
• Language: English
• ISBN-10: 1931695342
• ISBN-13: 978-1931695343
• Product Dimensions: 9 x 6.3 x 1.1 inches
• Shipping Weight: 1.4 pounds (View shipping rates and policies)
• Amazon Best Sellers Rank: #2,531,851 in Books (See Top 100 in Books)