Plasma etching plays an essential role in microelectronic circuit manufacturing. Suitable for researchers, process engineers, and graduate students, this book introduces the basic physics and chemistry of electrical discharges and relates them to plasma etching mechanisms. Throughout the volume the authors offer practical examples of process chemistry, equipment design, and production methods.
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Editorial Reviews
Review
"The subject matter is therefore well tuned to the needs of workers in the semiconductor industry, although it would also serve as an excellent textbook for a final undergraduate year or postgraduate course on the processing of semiconductor materials. This book is strongly recommended for the libraries of all universities and research laboratories working in the physical sciences."
--AUSTRALIAN PHYSICIST
[The authors] have produced a comprehensive and very readable book that will be especially valuable to the scientist or engineer just entering the field. The emphasis is clearly on understanding fundamental phenomena rather than specific recipes, thus its utility will outlive the present generation of processes and equipment.
--NUCLEAR INSTRUMENTS AND METHODS IN PHYSICS RESEARCH, Section B: Beam Interactions with Materials and Atoms
...They have produced a comprehensive and very readable book that will be especially vauable to the scientist or engineer just entering the field. The emphasis is clearly on understanding fundamental phenomena rather than specific recipes, thus its utility will outlive the present generation of processes and equipment.
--Thomas M. Mayer
SANDIA NATIONAL LABORATORIES
Good discussions of plasma chemistry, plasma diagnostics and handling hazardous gases used in plasmas.
--SOCIETY OF VACUUM COATERS
--AUSTRALIAN PHYSICIST
[The authors] have produced a comprehensive and very readable book that will be especially valuable to the scientist or engineer just entering the field. The emphasis is clearly on understanding fundamental phenomena rather than specific recipes, thus its utility will outlive the present generation of processes and equipment.
--NUCLEAR INSTRUMENTS AND METHODS IN PHYSICS RESEARCH, Section B: Beam Interactions with Materials and Atoms
...They have produced a comprehensive and very readable book that will be especially vauable to the scientist or engineer just entering the field. The emphasis is clearly on understanding fundamental phenomena rather than specific recipes, thus its utility will outlive the present generation of processes and equipment.
--Thomas M. Mayer
SANDIA NATIONAL LABORATORIES
Good discussions of plasma chemistry, plasma diagnostics and handling hazardous gases used in plasmas.
--SOCIETY OF VACUUM COATERS
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Inside This Book
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First Sentence:
The rapid development of plasma etching technology was stimulated by its application to the manufacture of microelectronic devices. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
plasma flux analysis, partial pressure analysis, plasma ion density, magnetic sheath, single wafer systems, aluminum etching, etchant species, vacuum vessel wall, magnetic fusion devices, microwave interferometry, ion bombardment energy, etch tunnel, gas cabinet, planar reactors, sheath capacitance, etch rate, increasing ion energy, etch cycle, high ion energy, chlorine plasma, accelerator grid, single wafer reactors, floating potential, nitride etching, etch gases Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, New Jersey, Kenneth Herb, Extended Abstracts, Academic Press, Electrochemical Society, Bell Laboratories, Solid State Technol, Plasma Chem, John Wiley, Plenum Press, Printing Office, Thin Solid Films, Ionized Gases, Collision Phenomena, District of Columbia, Microelectronic Manufacturing, San Diego, Thin Film Processes, Clarendon Press, Controlled Fusion Devices, Dry Processes, Microstructure Science, National Cancer Institute, Park Ridge New!
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Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
The rapid development of plasma etching technology was stimulated by its application to the manufacture of microelectronic devices. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
plasma flux analysis, partial pressure analysis, plasma ion density, magnetic sheath, single wafer systems, aluminum etching, etchant species, vacuum vessel wall, magnetic fusion devices, microwave interferometry, ion bombardment energy, etch tunnel, gas cabinet, planar reactors, sheath capacitance, etch rate, increasing ion energy, etch cycle, high ion energy, chlorine plasma, accelerator grid, single wafer reactors, floating potential, nitride etching, etch gases Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, New Jersey, Kenneth Herb, Extended Abstracts, Academic Press, Electrochemical Society, Bell Laboratories, Solid State Technol, Plasma Chem, John Wiley, Plenum Press, Printing Office, Thin Solid Films, Ionized Gases, Collision Phenomena, District of Columbia, Microelectronic Manufacturing, San Diego, Thin Film Processes, Clarendon Press, Controlled Fusion Devices, Dry Processes, Microstructure Science, National Cancer Institute, Park Ridge New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 47
books:
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24
books
cite this book:
See all 24 books citing this book
- Plasma Physics (Institute of Physics Conference Series) by Culham Laboratory on 4 pages
- Thin Film Processes by John L. Vossen on 4 pages
- Scientific Foundations of Vacuum Technique. Second Edition by Saul Dushman on page 386
- Cancer Causing Chemicals by N. Irving Sax on page 468
- Handbook of Compressed Gases by Compressed Gas Association Inc. on page 467
See all 47 books this book cites
- Signal Analysis: Time, Frequency, Scale, and Structure by Ronald L. Allen on page 373, and page 924
- Handbook of Vacuum Science and Technology by Dorothy Hoffman on page 606, and page 667
- Principles of Plasma Discharges and Materials Processing by Michael A. Lieberman in Back Matter (1), and Back Matter (2)
- Opto-Mechatronic Systems Handbook: Techniques and Applications (Handbook Series for Mechanical Engineering) by Hyungsuck Cho on page 432, and page 447
- Introduction to Microlithography (Acs Professional Reference Book) by Larry F. Thompson on page 494
See all 24 books citing this book
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