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Preventing Thermal Cycling and Vibration Failures in Electronic Equipment [Hardcover]

Dave S. Steinberg (Author)

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Book Description

Publication Date: June 22, 2001 | ISBN-10: 0471357294 | ISBN-13: 978-0471357292 | Edition: 1

This book deals with the packaging of electronic equipment to prevent damage from vibration and exposure to large variations in temperature.

#outer_postBodyPS { display: none; } #psGradient { display: none; } #psPlaceHolder { display: none; } #psExpand { display: none; } This book deals with the packaging of electronic equipment to prevent damage from vibration and exposure to large variations in temperature.

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Editorial Reviews

Review

"...text s purpose is to show manufacturers how to design, analyze, and evaluate electronic systems for lower cost and improved reliability in harsh environments..." (SciTech Book News, Vol. 25, No. 4, December 2001)

Product Details

Hardcover: 304 pages
Publisher: Wiley-Interscience; 1 edition (June 22, 2001)
Language: English
ISBN-10: 0471357294
ISBN-13: 978-0471357292
Product Dimensions: 9.5 x 6.2 x 0.7 inches
Shipping Weight: 15.2 ounces (View shipping rates and policies)
Amazon Best Sellers Rank: #645,063 in Books (See Top 100 in Books)

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Inside This Book (learn more)

First Sentence:
Electronic systems utilize many different metals and plastics in the manufacturing and assembly processes. Read the first page

Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
approximate fatigue life, wire fatigue life, solder joint shear stress, chassis natural frequency, kovar wire modulus, vibration input level, resonant dwell condition, large dynamic displacements, loose edge guides, reverse octave rule, fatigue damage ratio, fatigue exponent slope, forward octave rule, solder shear stress, standard bending stress equation, input acceleration level, adjacent snubbers, lead wires and solder joints, near zero stress condition, severe dynamic coupling, vibration fatigue life, electrical lead wires, copper circuit traces, corner solder joints, broadband random vibration

Key Phrases - Capitalized Phrases (CAPs): (learn more)
Solution Substitute, Machine Design Magazine, Substitute Eqs, Solution Set, Air Force

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Books on Related Topics | Concordance | Text Stats

Citations (learn more)

This book cites 8 books:

Vibration Analysis for Electronic Equipment by Dave S. Steinberg on page 269, and Back Matter
Mathematical Analysis by Wiley in Back Matter
Strength of Materials (2 Vol. Set) by Stephen Timoshenko in Back Matter
Eshbach's Handbook of Engineering Fundamentals, 4th Edition by Byron D. Tapley in Back Matter
Roark's Formulas for Stress and Strain by Warren Young in Back Matter

See all 8 books this book cites

3 books cite this book:

Cooling Techniques for Electronic Equipment, 2nd Edition by Dave S. Steinberg in Back Matter
Mechanical Analysis of Electronic Packaging Systems (Dekker Mechanical Engineering) by Mckeown on page 218
Multichip Module Technology Handbook by Philip E. Garrou on page 266

Books on Related Topics (learn more)

Cooling Techniques for Electronic Equipment, 2nd Edition by Dave S. Steinberg

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Vibration Analysis for Electronic Equipment by Dave S. Steinberg

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Cooling Techniques for Electronic Equipment, 2nd Edition by Dave S. Steinberg Hardcover
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