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Principles of Plasma Discharges and Materials Processing
 
 
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Principles of Plasma Discharges and Materials Processing [Hardcover]

Michael A. Lieberman (Author), Allan J. Lichtenberg (Author)
4.0 out of 5 stars  See all reviews (4 customer reviews)


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Book Description

0471005770 978-0471005773 October 14, 1994 1
Timely, authoritative, pedagogically consistent— a valuable professional resource and a superior didactic tool. Authored by two internationally respected pioneers in the field, this book offers a fully integrated, pedagogically consistent presentation of the fundamental physics and chemistry of partially ionized, chemically reactive, low-pressure plasmas and their roles in a wide range of plasma discharges and processes used in thin film processing applications—especially in the fabrication of integrated circuits. With many fully worked examples, practice exercises, and clear demonstrations of the relationship of plasma parameters to external control parameters and processing results, this book combines the best qualities of a student text and a professional resource.
  • In-depth coverage of the fundamentals of plasma physics and chemistry—includes separate chapters on atomic and molecular collisions
  • Applies basic theory to plasma discharges, including calculations of plasma parameters and scaling of plasma parameters with control parameters
  • Applies results to basic processing mechanisms and the effects of plasma parameters on those mechanisms
  • Uses numerous worked examples to demonstrate the relationships between control parameters, plasma parameters, and processing results

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Editorial Reviews

From the Publisher

Systematically treats the basics of plasma physics and chemistry in partially ionized, chemically reactive, low-pressure plasmas. Offers an understanding of the wide diversity of plasma discharges and procedures used in thin film processing applications, as in the fabrication of integrated circuits. Includes scores of worked examples and exercises.

From the Back Cover

Timely, authoritative, pedagogically consistent— a valuable professional resource and a superior didactic tool. Authored by two internationally respected pioneers in the field, this book offers a fully integrated, pedagogically consistent presentation of the fundamental physics and chemistry of partially ionized, chemically reactive, low-pressure plasmas and their roles in a wide range of plasma discharges and processes used in thin film processing applications—especially in the fabrication of integrated circuits. With many fully worked examples, practice exercises, and clear demonstrations of the relationship of plasma parameters to external control parameters and processing results, this book combines the best qualities of a student text and a professional resource.
  • In-depth coverage of the fundamentals of plasma physics and chemistry—includes separate chapters on atomic and molecular collisions
  • Applies basic theory to plasma discharges, including calculations of plasma parameters and scaling of plasma parameters with control parameters
  • Applies results to basic processing mechanisms and the effects of plasma parameters on those mechanisms
  • Uses numerous worked examples to demonstrate the relationships between control parameters, plasma parameters, and processing results

Product Details

  • Hardcover: 600 pages
  • Publisher: Wiley-Interscience; 1 edition (October 14, 1994)
  • Language: English
  • ISBN-10: 0471005770
  • ISBN-13: 978-0471005773
  • Product Dimensions: 9.6 x 6.5 x 1.3 inches
  • Shipping Weight: 2.3 pounds
  • Average Customer Review: 4.0 out of 5 stars  See all reviews (4 customer reviews)
  • Amazon Best Sellers Rank: #628,528 in Books (See Top 100 in Books)

 

Customer Reviews

4 Reviews
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Average Customer Review
4.0 out of 5 stars (4 customer reviews)
 
 
 
 
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14 of 19 people found the following review helpful:
1.0 out of 5 stars Overrated, May 4, 2000
By 
This review is from: Principles of Plasma Discharges and Materials Processing (Hardcover)
As a praciticing process engineer my opinion is this book lacks insight. Typical text book written a professor in the academic community with no practical experience. This book spends far to much time deriving equations and not discussing the basics concepts. The author makes a half hearted attempt to relate the first 14 chapters to the real worl, in a short and inadequate Chapter 15. This is the first mail book order book i took the time to return. In all honesty this book is not worth the $90.00. Spend your money elsewhere
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4 of 7 people found the following review helpful:
5.0 out of 5 stars An excellent overview of common plasma processing devices, December 9, 1998
By A Customer
This review is from: Principles of Plasma Discharges and Materials Processing (Hardcover)
Lieberman covers many of the standard processing devices and much of the physics needed to model them effectively.

The presentation is clear and extremely useful both as a reference and as a tutorial. A must-have book for anyone interested in plasma processing.

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5 of 9 people found the following review helpful:
5.0 out of 5 stars The book provides an excellent overview of plasma processing, December 9, 1998
By A Customer
This review is from: Principles of Plasma Discharges and Materials Processing (Hardcover)
This book provides an excellent introduction and overview of plasma discharges applied to semiconductor manufacturing. It is well-organized, clearly-written and full of useful examples and exercises. And unlike many books on plasma physics, it is not overly-mathematical and contains many useful physical insights. I strongly recommend this book for anyone wanting to review the field of plasma processing.
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Inside This Book (learn more)
First Sentence:
The plasma medium is complicated in that the charged particles are both affected by external electric and magnetic fields and contributes to them. Read the first page
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Academic Press, Physics of Thin Films, Monte Carlo
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