[ Be sure to read through to the Update at the end. Tweaking ReadyBoost allocation in Win7 x64 only makes this upgrade story BETTER. ]
The technical specs on these excellent SO-DIMMs are missing vital details here on Amazon. I aim to fix that in this detailed review.
And, this is also a case where before/after "benchmarks" can be very misleading...
My system's overall performance significantly improved, despite the fact that my before and after "benchmark" numbers got slightly worse. [See Update.]
Today's notebooks still use 64-bit wide Dual Channel memory architecture. If you want to maximize memory performance (kludge together a 128-bit memory pathway), always install matched pairs of SO-DIMMs. If you need a total of 8GB, then install 2 x 4GB. Do not buy one 8GB SO-DIMM and populate only one slot.
Samsung calls this "Kit" (a *factory matched pair*) of unbuffered, Dual Channel, 2x4GB, PC3-12800, 204-pin SO-DIMMs: "MV-3T4G3D/US." That's just the retail package number. The true *part number* that really matters is burned into each of these SO-DIMMs: M473B5273DH0-YK0.
These memory modules use 30nm technology and are rated for *both* 1.35VDC and 1.5VDC memory slots. This is very important. These SO-DIMMs will be just as wide as 40nm, 204-pin, PC3 SO-DIMMs, but they can be as much as 25% shorter than their 40nm cousins. Even if these SO-DIMMs have to run at 1.5VDC in your notebook, they'll draw less current (amps) and less total power (watts) than comparable 40nm SO-DIMMs.
Always go with manufacturer's "memory kits" (= factory matched pairs) when upgrading system memory. When you buy a kit and something goes wrong with one SO-DIMM under warranty, you replace both SO-DIMMs in order to maintain a factory matched pair of SO-DIMMs. You don't get that kind of warranty coverage when you buy loose, single SO-DIMMs.
Some sytems don't care about identically marked, but manufacturing mismatched, memory modules, while others will. There's no way to predict this in advance of trying. Why introduce an avoidable point of failure into your upgrade experience?
My SO-DIMMs were manufactured in Korea, but what really matters is that these are a factory matched pair. That means all silicon (including any chemistry variations contained therein) on both SO-DIMMs are from the same manufacturing lot. That will do a lot to eliminate Gremlin-like "timing" and power variances that can destablize and even cripple an otherwise working system.
Note the manufacturing dates and serial numbers of my SO-DIMMs in the exhibits that follow. They are from the same manufacturing batch. Thank you, Samsung.
You can save a few dimes, by buying loose, single SO-DIMMs with the same markings, but if they didn't come from the same manufacturing batch, the physical silicon can be significantly different. You run into this problem whenever a system boots and runs AOK with a single SO-DIMM installed, but becomes unstable or unbootable when two SO-DIMMs are installed. Neither SO-DIMM is defective, because they work just fine, all by themselves. The problem is they didn't come from the same manufacturing batch, so they don't work well in combination.
When you buy a kit and something goes wrong with one SO-DIMM under warranty, you replace both SO-DIMMs in order to maintain a factory matched pair of SO-DIMMs. If you didn't pay for both SO-DIMMs to work together, so you don't get to replace either of them under warranty until they finally do. If something does go wrong with only one SO-DIMM under warranty, you only get to replace that one SO-DIMM and not the pair.
The JEDEC timings table on the Samsung packaging is incomplete, but not incorrect.
Here's what my first generaton Intel Core i7 notebook physically reported:
Exhibit A Samsung M473B5273DH0-YK0 4GBx2
---------
DIMM # 1
SMBus address 0x50
Memory type DDR3
Module format SO-DIMM
Manufacturer (ID) Samsung (CE00000000000000)
Size 4096 MBytes
Max bandwidth PC3-12800 (800 MHz)
Part number M473B5273DH0-YK0
Serial number 35FA3023 <-- matched pair
Manufacturing date Week 11/Year 12 <-- matched pair
Number of banks 8
Nominal Voltage 1.50 Volts
EPP no
XMP no
JEDEC timings table CL-tRCD-tRP-tRAS-tRC @ frequency
JEDEC #1 5.0-5-5-14-19 @ 380 MHz <-- new
JEDEC #2 6.0-6-6-16-22 @ 457 MHz
JEDEC #3 7.0-7-7-19-26 @ 533 MHz
JEDEC #4 8.0-8-8-22-30 @ 609 MHz
JEDEC #5 9.0-9-9-24-33 @ 685 MHz
JEDEC #6 10.0-10-10-27-37 @ 761 MHz <-- new
JEDEC #7 11.0-11-11-30-41 @ 838 MHz <-- new
DIMM # 2
SMBus address 0x52
Memory type DDR3
Module format SO-DIMM
Manufacturer (ID) Samsung (CE00000000000000)
Size 4096 MBytes
Max bandwidth PC3-12800 (800 MHz)
Part number M473B5273DH0-YK0
Serial number 38FA3023 <-- matched pair
Manufacturing date Week 11/Year 12 <-- matched pair
Number of banks 8
Nominal Voltage 1.50 Volts
EPP no
XMP no
JEDEC timings table CL-tRCD-tRP-tRAS-tRC @ frequency
JEDEC #1 5.0-5-5-14-19 @ 380 MHz <-- new
JEDEC #2 6.0-6-6-16-22 @ 457 MHz
JEDEC #3 7.0-7-7-19-26 @ 533 MHz
JEDEC #4 8.0-8-8-22-30 @ 609 MHz
JEDEC #5 9.0-9-9-24-33 @ 685 MHz
JEDEC #6 10.0-10-10-27-37 @ 761 MHz <-- new
JEDEC #7 11.0-11-11-30-41 @ 838 MHz <-- new
My first generation Intel Core i7 HP notebook can't run these fast SO-DIMMs at their maximum speed. These are true PC3-12800 SO-DIMMs, but the chipset on my system board can only push these SO-DIMMs to PC3-10600 speeds. That's OK by me. "Perfectly spec-ed" 8GB of 40nm PC3-10600 is still more expensive to buy than these power sippers. As long as the new memory supports the JEDEC/CL timing that your system needs, you may install "faster" memory and run it slower.
My system settled on JEDEC #5 = CL9 for the new SO-DIMMs.
The missing values on the Samsung packaging are: JEDEC #1 (=CL5), #4 (=CL8) and #6 (=CL10). These Samsungs support CL5 through CL11.
Note, too, that my system is supplying these SO-DIMMs with 1.5VDC. Yes, these SO-DIMMs can run on only 1.35VDC, but they will draw fewer Amps @1.5VDC than equivalent 40nm SO-DIMMs, for an overall reduction in Watts used per GB in this notebook. That's a Good Thing.
Here's what originally shipped in my notebook, just for comparison:
DIMM # 1
SMBus address 0x50
Memory type DDR3
Module format SO-DIMM
Manufacturer (ID) Samsung (CE00000000000000)
Size 2048 MBytes
Max bandwidth PC3-10600 (667 MHz)
Part number
Serial number 076A6065 <-- matched pair
Manufacturing date Week 03/Year 10 <-- matched pair
Number of banks 8
Nominal Voltage 1.50 Volts
EPP no
XMP no
JEDEC timings table CL-tRCD-tRP-tRAS-tRC @ frequency
JEDEC #1 6.0-6-6-17-23 @ 457 MHz
JEDEC #2 7.0-7-7-20-27 @ 533 MHz
JEDEC #3 8.0-8-8-22-30 @ 609 MHz
JEDEC #4 9.0-9-9-25-34 @ 685 MHz
DIMM # 2
SMBus address 0x52
Memory type DDR3
Module format SO-DIMM
Manufacturer (ID) Samsung (CE00000000000000)
Size 2048 MBytes
Max bandwidth PC3-10600 (667 MHz)
Part number M471B5673EH1-CH9
Serial number 066A6065 <-- matched pair
Manufacturing date Week 03/Year 10 <-- matched pair
Number of banks 8
Nominal Voltage 1.50 Volts
EPP no
XMP no
JEDEC timings table CL-tRCD-tRP-tRAS-tRC @ frequency
JEDEC #1 6.0-6-6-17-23 @ 457 MHz
JEDEC #2 7.0-7-7-20-27 @ 533 MHz
JEDEC #3 8.0-8-8-22-30 @ 609 MHz
JEDEC #4 9.0-9-9-25-34 @ 685 MHz
I've used Crucial, Micron and Corsair SO-DIMMs on similar systems (whether PC2- or distinctly different PC3-) with no problems whatsover, as long as they were also factory matched pairs (aka Kits) and reputably sourced.
I stuck with Samsung, in this case, only because my gut told me to -- and because Samsung memory also has a great reputation in the business.
I ran Win7's most exhaustive pre-boot MEMTEST for >48 hours without error. The system booted on the first attempt, without having to go into the BIOS setups and has been rock stable (before and) after the upgrade.
I upgraded from 4GB because I'm running Win7 x64 Enterprise, with an Hyper-V boot option for running occasional virtualization labs. The pagefile hits to disk can be crippling at times. I really could use a total of 16GB of physical system memory, but I don't like today's price points. So, I settled for 8GB, instead.
When I ran some benchmarks, I was mildly disappointed. The numbers slightly *worsened* with 8GB than with 4GB. I ran a *lot* of benchmarks, but I will simplify here.
Let's take a look at the before and after Windows Experience Index as a crude and simple example.
Exhibit C.after Windows Experience Indexes
---------------
Windows Experience Index
Base score 5.7 (no change)
Determined by lowest subscore
Component Details Subscore
Processor Intel(R) Core(TM) i7 CPU Q 720 @ 1.60GHz 6.9 (dynamic)
Memory (RAM) 8GB (PC3-12800 M473B5273DH0-YK0 4GBx2) 7.3 <-- worse
Graphics NVIDIA GeForce GT 320M 1GB 5.7
Gaming graphics 4606 MB Total available graphics memory 5.9 <-- worse
Primary hard disk 79GB Free (281GB Total) 5.
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