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The Science and Engineering of Microelectronic Fabrication [Hardcover]

Stephen A. Campbell (Author)
3.7 out of 5 stars  See all reviews (10 customer reviews)


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There is a newer edition of this item:
Fabrication Engineering at the Micro and Nanoscale (The Oxford Series in Electrical and Computer Engineering) Fabrication Engineering at the Micro and Nanoscale (The Oxford Series in Electrical and Computer Engineering) 2.0 out of 5 stars (3)
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Book Description

February 15, 2001 0195136055 978-0195136050 2
Ideal for upper-level undergraduate or first-year graduate courses and as a handy reference for professionals, The Science and Engineering of Microelectronic Fabrication, Second Edition, provides a thorough and accessible introduction to the field of microfabrication. Revised and expanded in this second edition, the text covers all the basic unit processes used to fabricate integrated circuits, including photolithography, plasma and reactive ion etching, ion implantation, diffusion, oxidation, evaporation, vapor phase epitaxial growth, sputtering, and chemical vapor deposition. Advanced processing topics such as rapid thermal processing, next generation lithography, molecular beam epitaxy, and metal organic chemical vapor deposition are also presented. The physics and chemistry of each process is introduced along with descriptions of the equipment used for the manufacture of integrated circuits. The text also discusses the integration of these processes into common technologies such as CMOS, double poly bipolar, and GaAs MESFETs. Complexity/performance tradeoffs are evaluated along with a description of current state-of-the-art devices. Each chapter includes sample problems with solutions. The text makes use of the popular process simulation package SUPREM to provide more meaningful examples of the type of real-world dopant redistribution problems that microelectronic fabrication engineers must face.
This new edition includes a chapter on microelectromechanical structures (MEMS), an exciting new area in microfabrication. The coverage of MEMS includes fundamentals of mechanics; stress in thin films; mechanical to electrical transduction; mechanics of common MEMS devices; bulk micromachining etching techniques; bulk micromachining process flow; surface micromachining basics; surface micromachining process flow; MEMS actuators; and high aspect ratio microsystems technology (HARMST).


Editorial Reviews

Review

"This book addresses the material in an organized manner. The tool diagrams and photos are very useful. Figures, diagrams, SEMs, TEMs, are plentiful and necessary for this material."--Dr. Susan Marine, Centre College

"Excellent, up-to-date compilation of the physics and engineering of microelectronic chip processing. Good reference book for semiconductor manufacturing labs and engineering libraries. Very well documented."--David Navon, UMass--Amherst

"This is a very attractive book. It has a good balance of science, engineering and technology. The graphical, pictoral and SEM representatives add to the practical value of the book."--H. Thurman Henderson, Department of Electrical and Computer Engineering and Computer Science, University of Cincinnati

"Excellent! New textbooks on this subject appear rarely and with great gaps between appearances. This is the best of the last ten years."-- J.G. Smits, epartment of Electrical and Computer Engineering, Boston University

"Any one chapter could be expanded into a book by itself. An impressive piece of work!"-- Choice

"Appears to represent an excellent balance between practical, 'real world' information and theory. It will serve as an excellent complement to the standard type semiconductor materials and devices course in the realm of engineering applications. Such material should increase student appreciation and motivation for the field of semiconductors and enhance marketability."--Robert Engelken, Arkansas State University --This text refers to an out of print or unavailable edition of this title.

About the Author

Stephen A. Campbell is at University of Minnesota.

Product Details

  • Hardcover: 624 pages
  • Publisher: Oxford University Press, USA; 2 edition (February 15, 2001)
  • Language: English
  • ISBN-10: 0195136055
  • ISBN-13: 978-0195136050
  • Product Dimensions: 9.4 x 7.4 x 1.3 inches
  • Shipping Weight: 2.4 pounds
  • Average Customer Review: 3.7 out of 5 stars  See all reviews (10 customer reviews)
  • Amazon Best Sellers Rank: #798,404 in Books (See Top 100 in Books)

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Customer Reviews

10 Reviews
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Average Customer Review
3.7 out of 5 stars (10 customer reviews)
 
 
 
 
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Most Helpful Customer Reviews

18 of 19 people found the following review helpful:
1.0 out of 5 stars Strongly advise against, September 11, 2003
By 
Chris (Atlanta, GA United States) - See all my reviews
This review is from: The Science and Engineering of Microelectronic Fabrication (Hardcover)
I am a graduate student in engineering and have never encountered a less understandable book. The author repeatedly offers equations without proof or explaination of variables, frequently changes notation without notifying the reader, and has included far too many errors for a second edition book (ie eqn 3.11, a very important eqn). The problems at the end of the chapters frequently require equations that are not presented in the text (either omitted or included with errors) or that do not correspond to included graphs (check out fig 3.4 and see if you can tell which is GaAS and which is Silicon...then if you're ambitious check out the equation that corresponds to this figure and see if you can figure out whether the plot is correct or the equation is correct). Overall I have been very frustrated by the haphazard way in which this subject has been treated. If you have a class that uses this book, I suggest you get a another book to answer the questions that this one raises (Jaeger for example).
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9 of 11 people found the following review helpful:
5.0 out of 5 stars Comprehensive, detailed and easy to read, January 27, 1999
By A Customer
This excellent book by Stephen Campbell offers a comprehensive, in-depth look at many areas of microelectronics. It is also written in an easy to read style with a large number of relevant references. I recommend this book to anyone interested in the many areas of microelectronics.
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12 of 16 people found the following review helpful:
5.0 out of 5 stars Excellent introduction to modern microfabrication techniques, October 28, 1998
By A Customer
This is the text book for Mr. Campbell's microfabrication class (advanced undergraduate or graduate level) at the University of Minnesota, that's how I got to know this book. It covers all the different areas of modern microfabrication and puts them in the right context to one another. Any previous knowledge of these topics is not required.
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Inside This Book (learn more)
First Sentence:
The electronics industry has grown rapidly in the past four decades. Read the first page
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
most silicon technologies, micromachining process flow, areal image, latchup susceptibility, predeposition diffusion, thermal nitrides, residual gasses, piezoresistance coefficients, incommensurate growth, thermoplastic stress, shallow junction formation, pinchoff voltage, thermal nonuniformity, lateral encroachment, pad oxide, deep submicron devices, implant species, electron beam lithography systems, excimer sources, platen temperature, rapid thermal processing, field implant, rapid thermal processor, projection printers, ion implantation systems
Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Vacuum Sci, Electron Dev, Solid State Technol, Academic Press, The Electrochemical Society, Thin Solid Films, Bipolar Circuits, Diffusion Time, Ion-Beam Submicrometer Lithographies, Semiconductor Int, Park Ridge, John Wiley, Solid-State Electron, Monte Carlo, Applied Materials, Lattice Press, Semiconductor Silicon, Materials Res, Multilevel Metallization, Repeat Problem, Semiconductor Manufacturing Sci, Electron Dei, Elsevier Science, Sensors Actuators
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