Semiconductor Micromachining - Fundamentals and Technology - is a two volume work in which, for the first time, the various disciplines associated with the theory and practice of device fabrication are brought together in one comprehensive reference source. Volume 1 contains a detailed coverage of semiconductor electrochemistry and physics whilst Volume 2 describes the wide range of microengineering technologies with details of practical applications. The authors for each chapter have been carefully selected for their expertise and are acknowledged leaders in their respective fields. The purpose of this book is to enable workers in the area of semiconductor micromachining to have ready access to the basic literature, essential to provide a solid basis for the many different aspects of physics, chemistry, electronics and engineering involved with this technology. The main focus of the book is on structures based on silicon, the most common and versatile of the current range of commercially available semiconductors, but other materials such as III V semiconductors are also considered. Together these two volumes provide an indispensable reference text for this fast growing area of applied science. It will be of value to a wide range of academic and industrial scientists, technologists and engineers who wish to expand their knowledge in this area of science and for whom thus far, there has been no convenient reference work. Volume 2: Techniques and Industrial Applications
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A comprehensive guide to both the fundamental chemistry and physics of semiconductor processing. This book demonstrates the feasibility of structuring semiconductors for device technology.
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Semiconductor Micromachining - Fundamentals and Technology - is a two volume work in which, for the first time, the various disciplines associated with the theory and practice of device fabrication are brought together in one comprehensive reference source. Volume 1 contains a detailed coverage of semiconductor electrochemistry and physics whilst Volume 2 describes the wide range of microengineering technologies with details of practical applications. The authors for each chapter have been carefully selected for their expertise and are acknowledged leaders in their respective fields. The purpose of this book is to enable workers in the area of semiconductor micromachining to have ready access to the basic literature, essential to provide a solid basis for the many different aspects of physics, chemistry, electronics and engineering involved with this technology. The main focus of the book is on structures based on silicon, the most common and versatile of the current range of commercially available semiconductors, but other materials such as III?V semiconductors are also considered. Together these two volumes provide an indispensable reference text for this fast growing area of applied science. It will be of value to a wide range of academic and industrial scientists, technologists and engineers who wish to expand their knowledge in this area of science and for whom thus far, there has been no convenient reference work. Volume 2: Techniques and Industrial Applications
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The objective of this chapter is to provide a basic description of the processes that occur when current flows between a conducting solid electrode, particularly a semiconductor electrode, and an electrolyte, particularly an aqueous electrolyte. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
photocurrent oscillations, dark current transient, hole injecting species, flatband potential, dissolution valency, divalent dissolution, electroless photoetching, photoanodic etching, photoanodic dissolution, photoproduced holes, electroless etching, electropolishing regime, hole injection rate, redox potential scale, porous silicon formation, macroporous silicon, electropolishing treatment, dissolution valence, nanoporous silicon, polysulfide electrolyte, macroporous layer, nanoporous layer, oxide coverage, silicon skeleton, negative overvoltage Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Elsevier Science, John Wiley, Academic Press, Plenum Press, Solar Energy Mater, Sons Ltd, American Institute of Physics, Applied Physics Letters, Surf Sei, Electrochimica Acta, Consultants Bureau, Electrochemical Technology, Electrode Processes, Pergamon Press, Philips Technical Rev, Semiconductor Micronmchining, Solid State Commun, Solid-State Electron, Status Solidi, Surf Sci New!
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Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
The objective of this chapter is to provide a basic description of the processes that occur when current flows between a conducting solid electrode, particularly a semiconductor electrode, and an electrolyte, particularly an aqueous electrolyte. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
photocurrent oscillations, dark current transient, hole injecting species, flatband potential, dissolution valency, divalent dissolution, electroless photoetching, photoanodic etching, photoanodic dissolution, photoproduced holes, electroless etching, electropolishing regime, hole injection rate, redox potential scale, porous silicon formation, macroporous silicon, electropolishing treatment, dissolution valence, nanoporous silicon, polysulfide electrolyte, macroporous layer, nanoporous layer, oxide coverage, silicon skeleton, negative overvoltage Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Elsevier Science, John Wiley, Academic Press, Plenum Press, Solar Energy Mater, Sons Ltd, American Institute of Physics, Applied Physics Letters, Surf Sei, Electrochimica Acta, Consultants Bureau, Electrochemical Technology, Electrode Processes, Pergamon Press, Philips Technical Rev, Semiconductor Micronmchining, Solid State Commun, Solid-State Electron, Status Solidi, Surf Sci New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
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