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Semiconductor Micromachining, Techniques and Industrial Applications (Volume 2)
 
 
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Semiconductor Micromachining, Techniques and Industrial Applications (Volume 2) [Paperback]

S. A. Campbell (Editor), H. J. Lewerenz (Editor)

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Book Description

April 1998 0471966827 978-0471966821 Volume 2
Semiconductor Micromachining - Fundamentals and Technology - is a two volume work in which, for the first time, the various disciplines associated with the theory and practice of device fabrication are brought together in one comprehensive reference source. Volume 1 contains a detailed coverage of semiconductor electrochemistry and physics whilst Volume 2 describes the wide range of microengineering technologies with details of practical applications. The authors for each chapter have been carefully selected for their expertise and are acknowledged leaders in their respective fields. The purpose of this book is to enable workers in the area of semiconductor micromachining to have ready access to the basic literature, essential to provide a solid basis for the many different aspects of physics, chemistry, electronics and engineering involved with this technology. The main focus of the book is on structures based on silicon, the most common and versatile of the current range of commercially available semiconductors, but other materials such as III-V semiconductors are also considered. Together these two volumes provide an indispensable reference text for this fast growing area of applied science. It will be of value to a wide range of academic and industrial scientists, technologists and engineers who wish to expand their knowledge in this area of science and for whom thus far, there has been no convenient reference work. Volume 1: Fundamental Electrochemistry and Physics

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A comprehensive guide to both the fundamental chemistry and physics of semiconductor processing. This book demonstrates the feasibility of structuring semiconductors for device technology.

From the Back Cover

Semiconductor Micromachining - Fundamentals and Technology - is a two volume work in which, for the first time, the various disciplines associated with the theory and practice of device fabrication are brought together in one comprehensive reference source. Volume 1 contains a detailed coverage of semiconductor electrochemistry and physics whilst Volume 2 describes the wide range of microengineering technologies with details of practical applications. The authors for each chapter have been carefully selected for their expertise and are acknowledged leaders in their respective fields. The purpose of this book is to enable workers in the area of semiconductor micromachining to have ready access to the basic literature, essential to provide a solid basis for the many different aspects of physics, chemistry, electronics and engineering involved with this technology. The main focus of the book is on structures based on silicon, the most common and versatile of the current range of commercially available semiconductors, but other materials such as III-V semiconductors are also considered. Together these two volumes provide an indispensable reference text for this fast growing area of applied science. It will be of value to a wide range of academic and industrial scientists, technologists and engineers who wish to expand their knowledge in this area of science and for whom thus far, there has been no convenient reference work. Volume 1: Fundamental Electrochemistry and Physics

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Inside This Book (learn more)
First Sentence:
The idea for this book sprang from an after-dinner conversation in Southsea, late one evening in the Spring of 1992. Read the first page
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
critical voltage difference, mobile ionic charge density, anodization mode, best radiation resistance, chemical etch stops, constant current anodization, bottom cladding layer, cell voltage difference, deep boron diffusion, etch geometry, message segmenting, top cladding layer, fixed oxide charge density, etch geometries, grown oxide films, semiconductor micromachining, anodic oxide films, ohmic contact layer, bulk micromachining technologies, electroplated microstructures, surface state density, etch stop techniques, differential etch rates, silicon dissolution, etch rate ratios
Key Phrases - Capitalized Phrases (CAPs): (learn more)
Electron Devices, Extended Abstracts, New York, Spring Meeting, John Wiley, South Carolina, Hilton Head, University of Michigan, International Conference, Sons Ltd, Fall Meeting, Thin Solid Films, San Francisco, Technical Digest, Academic Press, Comments Reference, Etchant Composition, Ethanol Monoethanolamine, Marcel Dekker, Plenum Press, Proceedings of Transducers, Analog Devices, Ann Arbor, Photonics Technol, Power Semiconductor Devices
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