Two-phase microchannel cooling is one of the most promising thermal-management technologies for future high-power IC chips. Understanding the boiling process and the two-phase-flow behavior in microchannels is the key to successful implementation of a microchannel heat sink. This book focuses on the phase-change phenomena and the heat transfer in sub-150 nm diameter silicon microchannels, with emphasis on thermal measurement and modeling, and the impact of small dimensions on two-phase flow regimes.
Silicon Microchannel Heat Sinks
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Two-phase microchannel cooling is one of the most promising thermal-management technologies for future high-power IC chips. Understanding the boiling process and the two-phase flow behavior in microchannels is the key to successful implementation of a microchannel heat sink. This book focuses on the phase-change phenomena and the heat transfer in sub-150 mm diameter silicon microchannels, with emphasis on thermal measurement and modeling, and the impact of small dimensions on two-phase flow regimes. Scientists and engineers tackling thermal and MEMS problems will find the discussion in this book inspiring for their future design of microscale heat transfer experiments. This book will also contribute to the study of two-phase microchannel flows by providing extensive experimental data which are otherwise barely available.
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Inside This Book
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First Sentence:
In 1965, Dr. Moore of Intel Corporation predicted that the number of transistors on an integrated circuit would double every 18 months, known as "Moore's Law" [1.1]. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
input heat rate, microchannel heat sinks, freestanding beam, defective cavities, evaporating space, wall superheat, heat sink chip, annular flow model, wall temperature measurement, silicon thermometers, bubble nucleation process, wall temperature change, effective cooling area, diameter microchannels, eruption boiling, homogeneous flow model, annular flow regime, plain side walls, electroosmotic pumps, local wall temperatures, resistive thermometers, hydraulic diameter channel, silicon microchannels, aluminum heaters, microchannel flow Key Phrases - Capitalized Phrases (CAPs): (learn more)
Design Parameters of Test Devices, Moore's Law New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
In 1965, Dr. Moore of Intel Corporation predicted that the number of transistors on an integrated circuit would double every 18 months, known as "Moore's Law" [1.1]. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
input heat rate, microchannel heat sinks, freestanding beam, defective cavities, evaporating space, wall superheat, heat sink chip, annular flow model, wall temperature measurement, silicon thermometers, bubble nucleation process, wall temperature change, effective cooling area, diameter microchannels, eruption boiling, homogeneous flow model, annular flow regime, plain side walls, electroosmotic pumps, local wall temperatures, resistive thermometers, hydraulic diameter channel, silicon microchannels, aluminum heaters, microchannel flow Key Phrases - Capitalized Phrases (CAPs): (learn more)
Design Parameters of Test Devices, Moore's Law New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 8
books:
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- Laser Diode Microsystems (Microtechnology and MEMS) by Hans Zappe in Front Matter
- Enhanced Boiling Heat Transfer by John R. Thome in Back Matter
- Heat Exchangers by Holger Martin in Back Matter
- Fluid Mechanics with Student Resources CD-ROM by Frank M. White in Back Matter
- Mechanical Microsensors (Microtechnology and MEMS) by M. Elwenspoek in Front Matter
See all 8 books this book cites
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