Silicon Processing for the VLSI Era, Vol. 4: Deep-Submicron Process Technology [Hardcover]

Stanley Wolf (Author)

Product Details

• Hardcover: 822 pages
• Publisher: Lattice Press (May 2002)
• Language: English
• ISBN-10: 096167217X
• ISBN-13: 978-0961672171
• Product Dimensions: 9.5 x 7.1 x 1.7 inches
• Shipping Weight: 3.2 pounds (View shipping rates and policies)
• Average Customer Review: 4.7 out of 5 stars  See all reviews (3 customer reviews)
• Amazon Best Sellers Rank: #1,109,005 in Books (See Top 100 in Books)

Customer Reviews

Most Helpful Customer Reviews

5 of 6 people found the following review helpful:

5.0 out of 5 stars THE LATEST IN AN EXCELLENT SERIES, June 24, 2002

By 

R. Cohen (Salt Lake City, UT USA) - See all my reviews
(REAL NAME)   

This review is from: Silicon Processing for the VLSI Era, Vol. 4: Deep-Submicron Process Technology (Hardcover)

This well written reference book is highly recommended to anyone interested in the technology used to manufacture deep-submicron MOSFETs, i.e., MOSFETs requiring lithography in the 1/4 to 1/8-micron range. The first chapter nicely identifies several practical problems that appeared during the evolution of the MOSFET to ULSI, and the remainder of the book discusses processing solutions to those problems.

Major processing topics include thin gate oxides, self-aligned silicides, high- and low-k dielectrics, double and triple level metal interconnects, dual damascene copper interconnects, copper seed and electroplating technology, deep uv photoresists and tools, chemical-mechanical planarization, and processing issues unique to 300-mm wafers. State of the art CMOS topics including super-steep retrograde channel doping, punchthrough-control implants, source/drain engineering, shallow trench isolation, and more are used to illustrate the integration of deep-submicron processes into manufacturing. Increasing use of Si-Ge heterojunction bipolar transistors and silicon-on-insulator is anticipated and discussed.

This up-to-date book is one of a kind. It is simply required reading for those in the business.

2 of 2 people found the following review helpful:

5.0 out of 5 stars Excellent but a little outdated, August 10, 2009

By 

Vincent (Dallas) - See all my reviews

This review is from: Silicon Processing for the VLSI Era, Vol. 4: Deep-Submicron Process Technology (Hardcover)

This book provides a great amount of information on a field where there isn't much information to be found. It is easy to read and very descriptive - highly recommended.

It is a 2002 book though, talking about a field which evolves too quickly. Some of the "future" things the book talks about have already happened or the industry decided to move in a different direction, but in general this is not much a problem.

2 of 2 people found the following review helpful:

4.0 out of 5 stars Excellent review on the recent semiconductor processing, September 29, 2002

By 

Kyung-Mun Byun (Daejon, South Korea) - See all my reviews

This review is from: Silicon Processing for the VLSI Era, Vol. 4: Deep-Submicron Process Technology (Hardcover)

This book collects the hot issues on the very recent deep submicron (less than 0.18um) semiconductor process technology, such as EUV lithography, high and low k materials, CMP, and 300mm wafer. It seems to provide a good guideline to anyone who wonders what it is going on in the semiconductor process industry.