This resource guides hardware engineers through thermal, mechanical, electrical, acoustical, and EMI challenges-especially for PCs containing high-performance 1GHz+ processors. Various approaches and options for thermal management are explored, as are techniques for reducing EMI and acoustical noise. Examples of common problems are analyzed, such as preventing PCs from overheating due to lack of airflow, fitting multiple components into a small volume, and passing emissions requirements when there are higher speed signals radiating throughout a smaller PC.
