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4.0 out of 5 stars
Good,
Amazon Verified Purchase(What's this?)
This review is from: Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies (Hardcover)
The book was in great condition and came on time.
It is actually a very good first foundation book. |
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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies by John H. Lau (Hardcover - September 1, 1996)
Used & New from: $3.00
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