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Soldering in Electronics Assembly, Second Edition
 
 

Soldering in Electronics Assembly, Second Edition [Hardcover]

MIKE JUDD (Author), Keith Brindley (Author)
5.0 out of 5 stars  See all reviews (1 customer review)

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Book Description

0750635452 978-0750635455 April 14, 1999 2
Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly.



Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology.

Mike Judd is MD of Mike Judd Marketing and former MD of Electrovert UK, Director of Marketing Europe for Electrovert, part of the Cookson Group, and Director of OEM at Speedline.

Keith Brindley is a technical author with a wealth of experience of all aspects of electronics technology.

- A practical guide for the industry covering all the main soldering processes currently in use
- Cleaning, faults, troubleshooting and standards are all major topics
- Considers safety and solder process quality assessment

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Editorial Reviews

Review

'This excellent book clearly explains soldering processes, solder, flux, cleaning and quality control, as they apply to printed circuit board assembly. [The book] deserves a place on the desk or bench of everyone involved in the practical business of modern machine soldering in electronics.'
ITRI Journal

From the Publisher

Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology.

Mike Judd is MD of Mike Judd Marketing and former MD of Electrovert UK, Director of Marketing Europe for Electrovert, part of the Cookson Group, and Director of OEM at Speedline.

Keith Brindley is a technical author with a wealth of experience of all aspects of electronics technology.


Product Details

  • Hardcover: 369 pages
  • Publisher: Newnes; 2 edition (April 14, 1999)
  • Language: English
  • ISBN-10: 0750635452
  • ISBN-13: 978-0750635455
  • Product Dimensions: 10.1 x 7.7 x 1.1 inches
  • Shipping Weight: 2.1 pounds (View shipping rates and policies)
  • Average Customer Review: 5.0 out of 5 stars  See all reviews (1 customer review)
  • Amazon Best Sellers Rank: #2,606,254 in Books (See Top 100 in Books)

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4 of 6 people found the following review helpful:
5.0 out of 5 stars A definitive work on production soldering, March 26, 2000
By 
John Boyle (Wilkes Barre, Pennsylvania) - See all my reviews
This review is from: Soldering in Electronics Assembly, Second Edition (Hardcover)
Soldering in Electronics Assembly contains the broadest base of technology and materials related to all facets of electronic soldering. Our technical quality controls engineer here at The RSS Group has adopted the volume as the training and inspection standard for our assemblers and inspectors.

Any mechanical or design engineer needing a fine broad range technical information overview of the soldering processes 'must' have a copy of this work.

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Inside This Book (learn more)
First Sentence:
This chapter could be seen as just another introduction to soldering-it does, after all, explain in a fairly basic manner all important aspects of soldering in electronics assemblies. Read the first page
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
clad laminated sheet, defined flammability, heated collet, sectional specification, blank detail specification, capability approval, film dielectric capacitors, wave soldering system, print gap, wetting balance method, solder paste application, solder wave, low solids fluxes, soldering machines, service materiel, using solder paste, leaded components, dwell temperature, wave soldering machine, leadless components, circuit board track, soldering processes, conveyor angle, soldering systems, asymmetrical wave
Key Phrases - Capitalized Phrases (CAPs): (learn more)
Alpha Metals, Speedline Electrovert, Reference Part Content, Department of Defense, Siemens Aktiengesellschaft, Def Stan, Electronic Industries Association, Klein Wassink, Robert Crothers
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