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Structural Integrity and Reliability in Electronics: Enhancing Performance in a Lead-Free Environment
 
 
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Structural Integrity and Reliability in Electronics: Enhancing Performance in a Lead-Free Environment [Hardcover]

W.J. Plumbridge (Author), R.J. Matela (Author), A. Westwater (Author)

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Book Description

1402017650 978-1402017650 December 31, 2003 1
The World's largest industrial sector, Electronics, is facing twin challenges arising from the transition to environmentally-benign solder alloys and the necessity to maintain structural integrity and reliability in the face of continuing miniaturisation. This book is probably the first to address the situation from a multidisciplinary teaching perspective. The authors' expertise in Materials, Electronics Manufacture and Design are integrated throughout to establish a common platform and language for practitioners from the many fields involved. Communication is facilitated by a dual-level of presentation of the subject principles and the latest developments in industry and in research. Electronic routes for monitoring current and future progress are also provided. The book will appeal both to specialists wanting to update or increase their appreciation of related topics, and the generalist seeking relevant applications. It represents a major contribution to the field.

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Inside This Book (learn more)
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
solder geometry, superheat zone, termination tear, fillet lifting, acoustic micro imaging, high strain fatigue, surface mount transistor, replacement alloy, inelastic strain range, plastic strain range, thermomechanical fatigue, failure analysis laboratory, component terminations, reflow zone, component failure analysis, solder alloys, bulk solders, alternative alloys, joint reliability, solder wave, creep ductility, solder paste, reflow process, solder fillets, soldering process
Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Electronic Matls, Time Figure, Electronic Materials, Open University, Seventh Symp, Strain Figure, Trans Components
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