The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors’ knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.
Substrate Noise Coupling in RFICs
and over one million other books are available for Amazon Kindle.
Learn more
FREE Two-Day Shipping for Students. Learn more |
| ||||||||||||||||||||
Book Description
Special Offers and Product Promotions
- Buy $50 in qualifying physical textbooks, get $5 in Amazon MP3 Credit. Here's how (restrictions apply)
Editorial Reviews
From the Back Cover
Substrate Noise Coupling in RFICs addresses substrate noise coupling in RF and mixed signal ICs when used in a system on chip (SoC) containing digital ICs as well. This trend of integrating RF, mixed signal ICs with large digital ICs is found in many of today's commercial ICs such as single chip Wi-Fi or Bluetooth solutions and is expected to grow rapidly in the future. The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs . This is particularly critical when process feature sizes scale down to the nano meter range. Substrate Noise Coupling in RFICs reports silicon measurements, new test and noise isolation structures as well as calibration of a design flow used in the design and debug phases of RFICs. A design guide is articulated to be used by RFIC designers to maximize signal isolation and optimize chip floor plan, power and ground domains. Industrial examples of RFICs are given as demonstration vehicles to validate the proposed techniques. Some emphasis is put on the design of on-chip spiral inductors and the impact of the substrate on their performance. To our knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.
About the Author
Mohammed Ismail is the Springer Series Advisor for the Analog Circuits and Signal Processing book series
Product Details
Would you like to update product info or give feedback on images?
|
More About the Author
Discover books, learn about writers, read author blogs, and more.
Customer Reviews
|
There are no customer reviews yet.
|
|||
|
Video reviews
|
Inside This Book
(learn more)
Key Phrases - Statistically Improbable Phrases (SIPs):
(learn more)
enclosure distance, guard ring inductance, inductor design flow, guard ring isolation structure, baseline isolation, substrate isolation structures, substrate noise isolation, inductor body, substrate resistive network, substrate noise coupling, high resistive substrate, inductor performance, chip backside, differential inductor, bulk pin, substrate network, inductor quality factor, substrate resistivity, substrate model, sinking capability, resistive substrates, noise transmitter, interconnect parasitics, substrate coupling, guard rings Key Phrases - Capitalized Phrases (CAPs): (learn more)
Design Guide, Experimental Data, Springer Science, Calibrate the Design Flow, Business Media, System Level Case Study, Finite Difference, Effect of Back Plane Connection, Noise Coupling Mechanism Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Surprise Me!
enclosure distance, guard ring inductance, inductor design flow, guard ring isolation structure, baseline isolation, substrate isolation structures, substrate noise isolation, inductor body, substrate resistive network, substrate noise coupling, high resistive substrate, inductor performance, chip backside, differential inductor, bulk pin, substrate network, inductor quality factor, substrate resistivity, substrate model, sinking capability, resistive substrates, noise transmitter, interconnect parasitics, substrate coupling, guard rings Key Phrases - Capitalized Phrases (CAPs): (learn more)
Design Guide, Experimental Data, Springer Science, Calibrate the Design Flow, Business Media, System Level Case Study, Finite Difference, Effect of Back Plane Connection, Noise Coupling Mechanism Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Surprise Me!
Tag this product(What's this?)Think of a tag as a keyword or label you consider is strongly related to this product.
Tags will help all customers organize and find favorite items. |
Customer Discussions
|
This product's forum
Active discussions in related forums
Search Customer Discussions
|
Related forums
|
