This new edition continues to focus on educating the electronics engineer in surface mount principles, mainstream industry practices, and technology options. The author is a noted expert who is constantly in demand for training throughout the industry. The chapters are a walk-through of the actual assembly process. A new chapter discusses the effect of high pin count devices (fine pitch, BGA, and PGA) and their impact on board assembly. Practicing engineers will use the new appendix of vendors for components, sockets, material processes, and equipment. Expanded coverage of water soluble paste, no clean paste, and lead free solder addresses the environmental issues new to this industry.
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Inside This Book
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Key Phrases - Statistically Improbable Phrases (SIPs):
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land pattern design, ultra fine pitch packages, land pattern dimensions, solder skips, adhesive cure profile, joint cracking problems, leadless ceramic packages, leaded ceramic packages, mil pitch components, solder profile, active surface mount devices, different soldering processes, smart feeders, uneven fillets, minimum fillet height, solder paste viscosity, autoinsertion equipment, fine line boards, interpackage spacings, postcure properties, entrap flux, same land pattern, surface mount standards, metal electrode leadless, primary vapor zone Key Phrases - Capitalized Phrases (CAPs): (learn more)
Intel Corporation, United States, Surface Mount Council, Circuits Manufacturing, Montreal Protocol, Proceedings of Surface Mount International, Technical Review, Universal Instruments, Printed Circuit Assembly, Proceedings of Technical Program, Tessera Micro, Texas Instruments, Boeing Company, Circuits Assembly, Department of Defense, New York, San Jose, Travel Figure New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
land pattern design, ultra fine pitch packages, land pattern dimensions, solder skips, adhesive cure profile, joint cracking problems, leadless ceramic packages, leaded ceramic packages, mil pitch components, solder profile, active surface mount devices, different soldering processes, smart feeders, uneven fillets, minimum fillet height, solder paste viscosity, autoinsertion equipment, fine line boards, interpackage spacings, postcure properties, entrap flux, same land pattern, surface mount standards, metal electrode leadless, primary vapor zone Key Phrases - Capitalized Phrases (CAPs): (learn more)
Intel Corporation, United States, Surface Mount Council, Circuits Manufacturing, Montreal Protocol, Proceedings of Surface Mount International, Technical Review, Universal Instruments, Printed Circuit Assembly, Proceedings of Technical Program, Tessera Micro, Texas Instruments, Boeing Company, Circuits Assembly, Department of Defense, New York, San Jose, Travel Figure New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
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- Solders and Soldering: Materials, Design, Production, and Analysis for Reliable Bonding by Howard H. Manko on page 490
- Marketing High Technology by William H. Davidow on page 261
- Soldering in Electronics by R.J.Klein Wassink on page 490
- Electronic Packaging and Interconnection Handbook 4/E by Charles Harper on page 429, page 783, and page 873
- Modern Solder Technology for Competitive Electronics Manufacturing by Jennie S. Hwang on page 331, and page 395
- Essentials of Electronic Testing for Digital, Memory, and Mixed-Signal VLSI Circuits (Frontiers in Electronic Testing Volume 17) by M. Bushnell in Back Matter (1), and Back Matter (2)
- Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering) by John H. Lau on page 88, and page 408
- Implementing Lead-Free Electronics (Professional Engineering) by Jennie Hwang on page 30, and page 276
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