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  • TapeCase Amber Polyimide/Silicone Adhesive/Kapton Film Tape, Converted from 3M 5413, -100 to +500 degrees F Temperature Range, 36" Length, 4.72" Width, Roll
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TapeCase Amber Polyimide/Silicone Adhesive/Kapton Film Tape, Converted from 3M 5413, -100 to +500 degrees F Temperature Range, 36" Length, 4.72" Width, Roll


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Specifications for this item
Part Number 5413 4.72" x 36yd
Brand Name TapeCase
Material Type Polyimide , silicone Adhesive
Color Amber
LowerTemperature Range -100  Degrees Fahrenheit
Upper Temperature Range 500  Degrees Fahrenheit
UPC 888519227275
Compatible Material Printed Circuit Boards
EAN 0888519227275
Manufacturer Series Number 5413
Number of Items 1
Overall Length 36.0  yards
Overall Width 4.72  inches
Size 4.72" x 36 yd Roll
Thickness 0.0027  inches
UNSPSC Code 31201500

TapeCase Polyimide Film Tape-Converted from 3M 5413, is a 2.7 mil industrial grade tape product s... Read full product description



Product Features

  • Used for solder masking, creating release surfaces for parts cured at high temperatures, and other high temperature applications
  • Constructed with Kapton polyimide backing
  • Excellent high and low temperature performance
  • Flame retardant, chemical and radiation resistance
  • Reduced adhesive transfer onto substrates for easy cleaning

Product Details

  • Shipping Weight: 1.2 pounds
  • Domestic Shipping: Currently, item can be shipped only within the U.S. and to APO/FPO addresses. For APO/FPO shipments, please check with the manufacturer regarding warranty and support issues.
  • International Shipping: This item is not eligible for international shipping. Learn More
  • ASIN: B00KH0YDX8
  • Item model number: 3M 5413 4.72" x 36yd
  • Product Warranty: For warranty information about this product, please click here

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Product Description

TapeCase Polyimide Film Tape-Converted from 3M 5413, is a 2.7 mil industrial grade tape product specially constructed with a Kapton polyimide film backing. Featuring dimensional stability at high temperatures; flame, chemical, and radiation resistance; and a low rate of adhesive transfer onto the bonded substrate, this product provides valuable protective qualities while minimally leaving residue onto the masked components. This product is suitable for use in high temperature electrical applications such as solder masking and creating release surfaces for parts cured at high temperatures.

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