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Technology of Integrated Circuits (Springer Series in Advanced Microelectronics)
 
 
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Technology of Integrated Circuits (Springer Series in Advanced Microelectronics) [Hardcover]

D. Widmann (Author), H. Mader (Author), H. Friedrich (Author)

Price: $249.00 & this item ships for FREE with Super Saver Shipping. Details
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Book Description

August 17, 2000 3540661999 978-3540661993 1
This is the first book to comprehensively record the authors’ authoritative knowledge and practical experience of IC manufacturing, including the tremendous developments of recent years. With its strong application orientation, this is a must-have book for professionals in semiconductor industries.

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From the Back Cover

Strongly involved with SIEMENS Corp. in the tremendous recent developments of process technologies for IC fabrication the authors comprehensively record their authoritative knowledge and practical experience. New materials , modern planar technology, process designs for CMOS, Bipolar, BICMOS and smart-power technologies, self-adjusting doping techniques are just a few of the highlights. With its strong application-orientation this is a need-to-have book for professionals in semiconductor industries. Senior students in electrical engineering and physics can use it as a textbook because of the systematic treatment of the subjects. With regard to their later careers as industrial engineers they will particularly appreciate the deep insight into the actual methods and problems of IC manufacturing.

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Inside This Book (learn more)
First Sentence:
There has probably never been another technology that has developed so rapidly as microelectronics. Read the first page
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
subsequent ion implantation, planarize the wafer surface, last process step, polycide films, ion projection system, dopant atom concentration, possible process sequence, screen oxide, photoresist etching, using photoresist mask, ion lithography, phosphorus glass, bottom resist layer, small contact holes, wafer process step, ion beam writing, chemical etching reaction, contact hole etching, metallization level, aluminium interconnects, field oxide regions, chemical dry etching, focus latitude, implantation machine, last shrink
Key Phrases - Capitalized Phrases (CAPs): (learn more)
Passivation Metal, Apparatus Cleaning, Mono-Si Fig, Substrate Fig, Thin Film Transistor
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