Paperback. This book deals with recent progress in the analysis of macro and microscale heat transfer, cooling techniques and thermally induced failures in electronic systems. The field covers microelectronic, power electronic, opto-electronic, etc. Analysis focuses on systems and component levels as well as integrated circuits, multichip modules, high density packages, sensors, card. The papers deal with: Thermal management in optimal design / Thermal characterization and measurement techniques / Analytical and computational thermal modelling / Single and multiphase convective cooling / Applications of new materials in thermal management / Thermal reliability / Thermal problems in material and package processing.
FREE Two-Day Shipping for students on millions of items. Learn more |
Book Description
Product Details
Would you like to update product info or give feedback on images?
|
Customer Reviews
|
There are no customer reviews yet.
|
|||
|
Video reviews
|
Tag this product(What's this?)Think of a tag as a keyword or label you consider is strongly related to this product.
Tags will help all customers organize and find favorite items. |
Sell a Digital Version of This Book in the Kindle Store
If you are a publisher or author and hold the digital rights to a book, you can sell a digital version of it in our Kindle Store.
Learn more
Customer Discussions
|
This product's forum
Active discussions in related forums
Search Customer Discussions
|
Related forums
|
