Thermal Management Handbook: For Electronic Assemblies (Hardcover)

by Jerry Sergent (Author), Al Krum (Author), IMAPS (ISHM) (Author) "The term thermal management encompasses the technology of the generation and control of heat in electronics circuits..." (more)
Key Phrases: direct bond copper, thermal designer, evaporator area, New York, Andy Ezis, International Rectifier (more...)

Editorial Reviews

Product Description
In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges -- and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage -- and preventing thermal-related problems from occurring in the first place.

From the Back Cover
The "hands-on" guide to thermal management! Thermal Management Handbook.

In recent years, heat-sensitive electronics systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges - and making thermal management a critical design factor. This timely handbook is the most current and comprehensive reference on the practical issues that any packaging engineer must consider with regard to the thermal management f printed circuit boards, hybrid circuits, and multichip modules. In addition to presenting and exploring the three basic issues at the core of effective thermal management - how and where the heat is generated; how the temperature at a given point in the circuit is determined; and how the heat is removed - the book is enhanced with tutorial chapters, data tables, and a wealth of design examples. Professionals will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design state - and preventing thermal-related problems from occurring in the first place.

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Product Details

• Hardcover: 650 pages
• Publisher: McGraw-Hill Professional; 1 edition (May 31, 1998)
• Language: English
• ISBN-10: 0070266999
• ISBN-13: 978-0070266995
• Product Dimensions: 9.1 x 6.1 x 1.1 inches
• Shipping Weight: 1.6 pounds (View shipping rates and policies)
• Average Customer Review: 3.0 out of 5 stars See all reviews (3 customer reviews)
• Amazon.com Sales Rank: #722,600 in Books (See Bestsellers in Books)

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  #44 in	Books > Computers & Internet > Computer Science > Circuitry > Microelectronic Devices
  #100 in	Books > Professional & Technical > Engineering > Electrical & Electronics > Electronics > Apparatus, Devices & Design

Customer Reviews

Most Helpful Customer Reviews

2.0 out of 5 stars great as a reference but with some confusion, March 30, 2009

By	Mahmoud Zreik "ze zreik" (NJ, USA) - See all my reviews (REAL NAME)

this book is good as a reference however the two authors gave contradictory and erroneous analysis on some pages

example: page 5.18 -5.19 totally contradicts page 7.10; 7.11.
and also in 7.10 W2 is totaly wrong with sin.

3.0 out of 5 stars Reads like a textbook, November 23, 2008

By	Timothy Beech "eTrader Store, Inc" (Ellisville, MS USA) - See all my reviews (REAL NAME)

This book is full of great information and is well organized; however, it has the read quality of a textbook. If this is what you are looking for, than this is the book for you. It really works best as a reference guide.

4.0 out of 5 stars Excellent casual referance, June 1, 2001

By	Raymond E. Rogers (Standish, ME 04084) - See all my reviews (REAL NAME)

This book has achieved just the right balance between throughness and overview so that I have been able to refer to it in a casual manner (once every 3-6 months) and been able to use the results without taking a new college course. I am a practicing Analog electronics engineer and thermal engineering is something I only do once (perhaps more ?) during a design/project.