Customer Reviews

Thermal Management Handbook: For Electronic Assemblies

5 star:		(0)
4 star:		(1)
3 star:		(2)
2 star:		(1)
1 star:		(0)

 

 

This book has some great material that can't be found anywhere else, such as clear examples for calculating silicon dies thermal stresses and other electronic packaging niche topics. It's well written, but sometimes fails to provide justifications for some of the important assertions that the readers are forced to accept. The quantity of glaring typographical errors and errors in formulas made this otherwise great text just mediocre.

This book is full of great information and is well organized; however, it has the read quality of a textbook. If this is what you are looking for, than this is the book for you. It really works best as a reference guide.

This book has achieved just the right balance between throughness and overview so that I have been able to refer to it in a casual manner (once every 3-6 months) and been able to use the results without taking a new college course. I am a practicing Analog electronics engineer and thermal engineering is something I only do once (perhaps more ?) during a design/project.

this book is good as a reference however the two authors gave contradictory and erroneous analysis on some pages

example: page 5.18 -5.19 totally contradicts page 7.10; 7.11.
and also in 7.10 W2 is totaly wrong with sin.