Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods and Design Practices (Asme Press Book Series on Electronic Packaging) [Hardcover]

Lian-Tuu Yeh (Author), Richard C. Chu (Author), Dereje Agonafer (Editor)

Book Description

ISBN-10: 0791801683 | ISBN-13: 978-0791801680 | Publication Date: September 1, 2002 | Edition: 1st

With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.

Product Details

• Hardcover: 414 pages
• Publisher: ASME Press (American Society of Mechanical Engineers); 1st edition (September 1, 2002)
• Language: English
• ISBN-10: 0791801683
• ISBN-13: 978-0791801680
• Product Dimensions: 9.4 x 6.4 x 1.2 inches
• Shipping Weight: 1.8 pounds (View shipping rates and policies)
• Amazon Best Sellers Rank: #1,620,956 in Books (See Top 100 in Books)

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