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Thin Film Technology Handbook [Hardcover]

Aicha Eishabini-Riad (Author), Fred D. Barlow (Author), ISHN (Author)
4.0 out of 5 stars  See all reviews (1 customer review)


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Book Description

0070190259 978-0070190252 November 1, 1997 1
The most comprehensive source available on the preparation, characterization, and emerging applications of thin film. This book features extensive new advances applied in multichip modules (MCMs), and covers the basic principles and applications of thin film deposition techniques for practical use. It provides and develops design guidelines to realize multilayer structures in microcircuits, thus addressing a critical and rapidly growing area.


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From the Back Cover

The most complete and current guide anywhere to every facet of thin films. From basic scientific precepts to today's emerging applications, here is the most complete guide to thin film technology available. As practical as it is comprehensive, the Thin Film Technology Handbook provides the kind of authoritative, in-depth coverage that assures its place as the standard in the field--now, and for years to come. Featuring contributions from leading experts, the Handbook spans the full spectrum of important topics, including: deposition techniques and processes, vacuum technology, and generation of patterned films; properties of substrate, conductor, resistive, dielectric, and semiconductor materials and protective coatings; electrical, mechanical, chemical, and thermal properties of thin films; design guidelines for thin film components and multilayer structures in microcircuits; recent advances in diamond films and thin film optical materials; applications involving hybrid thin film components on ceramic, thin film multilayer modules on silicon or metal, multichip modules, interconnects, and electronic packaging. This compendium of fundamental principles, current knowledge, and cutting-edge research on thin film technology is an invaluable reference for engineering professionals, scientists, researchers, and everyone else working in this fast-developing area.

Product Details

  • Hardcover: 640 pages
  • Publisher: McGraw-Hill Professional; 1 edition (November 1, 1997)
  • Language: English
  • ISBN-10: 0070190259
  • ISBN-13: 978-0070190252
  • Product Dimensions: 9.3 x 6.3 x 1.9 inches
  • Shipping Weight: 2.9 pounds
  • Average Customer Review: 4.0 out of 5 stars  See all reviews (1 customer review)
  • Amazon Best Sellers Rank: #2,160,683 in Books (See Top 100 in Books)

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1 of 1 people found the following review helpful:
4.0 out of 5 stars Not really a lot of overlap with earlier thin film handbooks..., November 7, 2007
This review is from: Thin Film Technology Handbook (Hardcover)
For the basics, I believe Maissel and Glang's Handbook of Thin Film Technology has much more information and goes into much greater detail about basic techniques (vacuum methods, evaporation, sputtering, etc.). In my opinion, this newer handbook can be seen as an addendum to the above 1970-era work. There are nice chapters on thin film optical materials by Angus Macleod and semiconductor thin films by Larry Kazmerski, true experts in these areas. I found the chapter on diamond films interesting also. Most chapters have more of a survey than an in-depth feel. Not to nit-pick, but as an example, when counting sheet resistance squares in the design of a meander-type resistor, this book reports a corner square as 0.5 when it is actually 0.559, and while a 10% error is not such a big deal for back-of-the envelope estimation, most thin film resistors are used in precision circuits where such error levels are important. Overall, although pricey, I think it is a nice addition to your library if you deal with thin films often. However, I would spend money to get a used copy of Thin Film Technology by Berry Hall and Harris or the above work by Maissel and Glang first.
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Inside This Book (learn more)
First Sentence:
Modern thin film technology has evolved into a sophisticated set of techniques used to fabricate many products. Read the first page
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
halfwave points, projection laser ablation, thin film multilayer interconnections, quarterwave stack, polycrystalline semiconductor films, rapid thermal curing, thin film resistor materials, diamond heat spreader, thin film interconnect, thin film packaging, thin film multichip modules, wettable area, resistor stability, photoconductive decay, emergent medium, diamond nucleation, diamond deposition, photosensitive polyimides, polycrystalline semiconductors, thin film capacitors, incoming electron beam, microwave hybrids, thin film hybrids, semiconducting diamond, thin film circuits
Key Phrases - Capitalized Phrases (CAPs): (learn more)
Appl Phys, New York, Phys Rev, Academic Press, Thin Solid Films, John Wiley, Multichip Module Conf, Plenum Press, Vac Sci Technol, Mater Res, Proceed Int Conf, Proc of the Intl Test Conf, Electrochem Soc, Electrochemical Society, Materials Research Society, Dia Rel Mat, Surf Sci, Elsevier Science, Mater Sci, New Diamond, Park Ridge, Phil Mag, Phys Stat Sol, Soc London, Trans Electron Dev
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