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Tribology of Abrasive Machining Processes
 
 
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Tribology of Abrasive Machining Processes [Hardcover]

Ioan D. Marinescu (Author), W. Brian Rowe (Author), Boris Dimitrov (Author), Ichiro Inaski (Author)

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Book Description

January 14, 2005 0815514905 978-0815514909 1
Recent and radically improved machining processes, from high wheel speeds to nanotechnology, have turned a spotlight on abrasive machining processes as a fertile area for further advancements. Written for researchers, students, engineers and technicians in manufacturing, this book presents a fundamental rethinking of important tribological elements of abrasive machining processes and their effects on process efficiency and product quality. Newer processes such as chemical mechanical polishing (CMP) and silicon wafer dicing can be better understood as tribological processes. Understanding the tribological principles of abrasive processes is crucial to discovering improvements in accuracy, production rate, and surface quality of products spanning all industries, from machine parts to ball bearings to contact lens to semiconductors.

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About the Author

W. Brian Rowe is a consulting engineer and recognized bearing expert with more than 30 years' experience working on a wide range of machinery design problems across all industries. He has previously run courses on bearings at Coventry University in the UK and Stanford University in the USA, as well as sessions on the topic for industrial engineers in Chengdu, China. He contributed an article on hydrostatic bearings to the current edition of our Tribology Handbook and has received awards in recognition for his work, including the Walter R. Evans Award for significant contributions to the field of rotor dynamics in 2004.


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Inside This Book (learn more)
First Sentence:
Abrasive machining processes are manufacturing techniques which employ very hard granular particles in machining, abrading, or polishing to modify the shape and surface texture of manufactured parts. Read the first page
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
cutting edge density, abrasive machining processes, geometric contact length, useful flowrate, real contact length, creep grinding, effective wheel diameter, high wheelspeeds, superabrasive grains, abrasive machining system, mean chip thickness, high efficiency deep grinding, superabrasive wheels, maximum uncut chip thickness, ploughing energy, semisynthetic emulsions, grain penetration depth, triangular heat flux, equivalent chip thickness, superabrasive tools, wear flat area, workpiece roughness, machine control variables, alumina wheel, shoe nozzle
Key Phrases - Capitalized Phrases (CAPs): (learn more)
Wear of Materials, Grinding Technology, Thermal Design of Processes, Ceramic Trans, Ellis Horwood, Marcel Dekker Inc, Metalworking Fluids, New York, Pergamon Press, Tribology Int, Kinematic Models of Abrasive Contacts, Tribochemistry of Abrasive Machining, Workpiece Figure, American National Standards Institute, Beers Ind, Case Study, Cut Tool Eng, General Electric, Grinding Conf, John Wiley, Noyes Publ, Oxford Science Publ, Trihologv Int, Vachining Processes, Archard's Law
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