"Two of the most important trends in sensor development in recent years have been advances in micromachined sensing elements of all kinds, and the increase in intelligence applied at the sensor level. This book addresses both, and provides a good overview of current technology". -- I&CS
Understanding Smart Sensors (Artech House Sensors Library)
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Book Description
Editorial Reviews
About the Author
Randy Frank is Technical Marketing Manager with ON Semiconductor in Phoenix, Arizona. Author of over 200 technical papers, he received his B.S. and M.S. in Electrical Engineering, as well as his M.B.A. in Management, from Wayne State University in Detroit, Michigan. He is a member of the Society of Automotive Engineers and former chairman of its Sensors Standards Committee, and a member of the IEEE and its Sensor Terminology Taskforce.
--This text refers to an alternate
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0 of 1 people found the following review helpful:
5.0 out of 5 stars
Great overview,
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This review is from: Understanding Smart Sensors (Artech House Sensors Library) (Hardcover)
This book presents a great overview of sensor technologies without getting too technical. The techniques discussed are exhaustive as evident from the references at the end of each chapter.
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Inside This Book
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First Sentence:
Just about everything today in the technology area is a candidate for having the prefix smart added to it. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
semiconductor pressure sensors, transducer bus interface module, transducer electronic data sheet, integrated pressure sensor, silicon fusion bonding, smart sensors, smart transducer interface, smart sensing, silicon pressure sensors, advanced semiconductor technologies, micromachined structure, micromachining process, micromachined sensors, semiconductor sensors, sequence sensor, micromachining technology, signal conditioning circuitry, bottom wafer, sensor manufacturers, top wafer, micromachining techniques, field emission displays, silicon diaphragm, application processor, wafer bonding Key Phrases - Capitalized Phrases (CAPs): (learn more)
Sensors Expo, Hilton Head, San Jose, Courtesy of Motorola, Sensor Device Data, Technical Digest, Electronic Engineering Times, Control Engineering, Machine Design, Motorola Application Note, New York, University of California, Courtesy of Sandia National Laboratories, Design News, Echelon Corporation, Network Figure, San Francisco, Solid State Technology, Micromachine Devices, Robert Bosch, Transducer Technology New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Just about everything today in the technology area is a candidate for having the prefix smart added to it. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
semiconductor pressure sensors, transducer bus interface module, transducer electronic data sheet, integrated pressure sensor, silicon fusion bonding, smart sensors, smart transducer interface, smart sensing, silicon pressure sensors, advanced semiconductor technologies, micromachined structure, micromachining process, micromachined sensors, semiconductor sensors, sequence sensor, micromachining technology, signal conditioning circuitry, bottom wafer, sensor manufacturers, top wafer, micromachining techniques, field emission displays, silicon diaphragm, application processor, wafer bonding Key Phrases - Capitalized Phrases (CAPs): (learn more)
Sensors Expo, Hilton Head, San Jose, Courtesy of Motorola, Sensor Device Data, Technical Digest, Electronic Engineering Times, Control Engineering, Machine Design, Motorola Application Note, New York, University of California, Courtesy of Sandia National Laboratories, Design News, Echelon Corporation, Network Figure, San Francisco, Solid State Technology, Micromachine Devices, Robert Bosch, Transducer Technology New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 22
books:
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17
books
cite this book:
See all 17 books citing this book
- Sensor Technology and Devices (Optoelectronics Library) by Ljubisa Ristic on page 45, page 246, and Back Matter
- Semiconductor Sensors by Simon M. Sze in Back Matter
- Smart Structures and Materials (Artech House Optoelectronics Library) by Brian Culshaw in Back Matter
- Adaptive Control (An Independent Learning Module from the Instrument Society of America) by Chang C. Hang on page 170
- Microelectromechanical Systems Mems by a.P. Lee on page 45
See all 22 books this book cites
- Intelligent Fault Diagnosis and Prognosis for Engineering Systems by George Vachtsevanos on page 92, and page 166
- Microsensors, MEMS and Smart Devices by Julian W. Gardner on page 443, and Back Matter
- Motor Control Electronics Handbook by Richard Valentine on page 561
- Magnetic Sensors and Magnetometers (Artech House Remote Sensing Library) by Pavel Ripka in Back Matter
- Mathematical Techniques in Multisensor Data Fusion (Artech House Information Warfare Library) by David L. Hall on page 34
See all 17 books citing this book
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