This comprehensive collection of reprinted articles presents the most important developments on VLSI contact and interconnect technologies and applications. The book covers important developments in metallization of compound semiconductor technologies, and includes a section on metallization reliability and high speed testing.
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Inside This Book
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First Sentence:
We shall present a brief overview of the historic developments that culminated in the current state of microelectronic metallization. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
direct electrooptic sampling, optical transit time, uniform interfacial layer, front contact resistance, ultrashort electrical pulses, bandwidth electrical pulses, frontside probing, minimum detectable voltage, silicide roughness, end contact resistance, cosputtered silicides, lossy waveguide interconnections, silicided devices, interfacial contact resistance, cosputtered alloy, minimal transistor, picosecond photoconductors, diffusion taps, shoulder magnitude, sintered ohmic contacts, polysilicon buffer, sintered contacts, barrier pinning, gate sheet resistance, metallization using aluminum Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Thin Solid Films, Solid-State Electron, Stanford University, Electrochemical Society, Bell Laboratories, Electron Device Lett, Layer Hybrid, Solid-State Circuits, Solid State Electron, Microwave Theory Tech, Murray Hill, Academic Press, Log Number, Quantum Electron, American Physical Society, Indian Institute of Technology, Materials Research Society, Solid State Technol, Bell Telephone Laboratories, First Int, Los Angeles, North Carolina State University, Palo Alto, Solid-State Technol New!
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Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
We shall present a brief overview of the historic developments that culminated in the current state of microelectronic metallization. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
direct electrooptic sampling, optical transit time, uniform interfacial layer, front contact resistance, ultrashort electrical pulses, bandwidth electrical pulses, frontside probing, minimum detectable voltage, silicide roughness, end contact resistance, cosputtered silicides, lossy waveguide interconnections, silicided devices, interfacial contact resistance, cosputtered alloy, minimal transistor, picosecond photoconductors, diffusion taps, shoulder magnitude, sintered ohmic contacts, polysilicon buffer, sintered contacts, barrier pinning, gate sheet resistance, metallization using aluminum Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Thin Solid Films, Solid-State Electron, Stanford University, Electrochemical Society, Bell Laboratories, Electron Device Lett, Layer Hybrid, Solid-State Circuits, Solid State Electron, Microwave Theory Tech, Murray Hill, Academic Press, Log Number, Quantum Electron, American Physical Society, Indian Institute of Technology, Materials Research Society, Solid State Technol, Bell Telephone Laboratories, First Int, Los Angeles, North Carolina State University, Palo Alto, Solid-State Technol New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 40
books:
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- Semiconductor Devices: Solutions Manual: Physics and Technology by Simon M. Sze on 7 pages
- Thin Films: Interdiffusion and Reactions (Electrochemical Society) by John Milo Poate on 7 pages
- Physics of Semiconductor Devices by Simon M. Sze on 4 pages
- A30.5 Integrated Circuits Video by Thomson Delmar Learning on page 202, page 471, and page 508
- Identification of Defects in Semiconductors, Volume 51B (Semiconductors & Semimetals) (Vol 51B) by Michael Stavola on page 79, page 342, and page 364
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