This book deals with the analysis of various types of vibration environments that can lead to the failure of electronic systems or components.
Vibration Analysis for Electronic Equipment
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Editorial Reviews
From the Publisher
A practical guide to quick methods for designing electronic equipment that must withstand severe vibration and shock--and the only book that shows how to predict the operational life of electronic equipment, based on the component type and type of vibration and shock exposure. This 2nd Edition presents new material, never published before, on predicting fatigue life in sinusoidal vibration, random vibration and acoustic noise, and pyrotechnic shock. Each new concept is given one or more detailed sample problems, and there is extensive coverage of testing methods. Treatment is kept as simple as possible (consistent with the important governing equations), with emphasis on actual, currently-used hardware.
--This text refers to an out of print or unavailable edition of this title.
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Most Helpful Customer Reviews
17 of 17 people found the following review helpful:
5.0 out of 5 stars
Application beyond just electronics,
This review is from: Vibration Analysis for Electronic Equipment, 2nd Edition (Hardcover)
The author is obviously an engineer who understands the everyday practical problems a dynamicist faces. Some theory, but chock full of easy to understand, and more importantly, *useful* information necessary to put properly designed product out the door.Don't let the title fool you. The focus of this book is electronics, but the material here is applicable to any vibration problem. If you're doing any dynamics work, you NEED this book.
16 of 16 people found the following review helpful:
4.0 out of 5 stars
A tool for success,
By Frederick C. Sebly (USA) - See all my reviews
This review is from: Vibration Analysis for Electronic Equipment, 2nd Edition (Hardcover)
If a mechanical engineer has chosen a career in the world of electronics, I strongly recommend this easy to follow gold mine of a book. I say it is a gold mine because it applies directly to the engineers' job. There are no fluff chapters or topics. Everything applies. Steinberg has made it easy (and almost fun) to solve those every day shock, vibration and acoustic challenges. Finding the natural frequency of a body such as a PC board is so much simpler for me now. And a surprising tidbit was for me to discover some amazing facts concerning acoustics. This is especially important as applied to fan cooled electronic packages. Another important area of study was packaging for transportation. How many times have we simply said "Just pack it in foam"? Before reading this book, I couldn't be sure what foam density to use or what the optimum thickness was. Why guess? Do it right.I borrowed this book from my employer, took it home and read it over the long Christmas weekend. I was so impressed, that I am purchasing my personal copy tonight. I won't be without it.
12 of 15 people found the following review helpful:
5.0 out of 5 stars
This Book is to the point, get it done, structural dynamics.,
By Michael W. Rogers(waynor1@earthlink.net) (Los Angeles, California) - See all my reviews
This review is from: Vibration Analysis for Electronic Equipment, 2nd Edition (Hardcover)
This reference is a must read for any structural engineer entering into the the electronic packaging world. You can't go wrong with the easy to understand examples and extra insight the book gives to the rapid engineering production world we live in today. Michael Rogers - Structural Engineer
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Inside This Book
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First Sentence:
The natural frequency of many single-degree-of-freedom systems can be determined by evaluating the characteristics of the strain energy and the kinetic energy of each system. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
reverse octave rule, peak sinusoidal vibration input, approximate fatigue life, lead wire strain relief, side wedge clamps, forward octave rule, shock acceleration levels, sinusoidal vibration environment, uncoupled transmissibility, vibration input level, wire fatigue life, side edge guides, acceleration input level, cumulative fatigue damage ratio, approximate transmissibility, shock amplification, electrical lead wires, chassis resonance, shaker head, slider plate, broadband random vibration, input acceleration level, relative position factor, thermal cycling screen, vibration fatigue life Key Phrases - Capitalized Phrases (CAPs): (learn more)
Substitute Eqs, Item Area, Using Castigliano New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
The natural frequency of many single-degree-of-freedom systems can be determined by evaluating the characteristics of the strain energy and the kinetic energy of each system. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
reverse octave rule, peak sinusoidal vibration input, approximate fatigue life, lead wire strain relief, side wedge clamps, forward octave rule, shock acceleration levels, sinusoidal vibration environment, uncoupled transmissibility, vibration input level, wire fatigue life, side edge guides, acceleration input level, cumulative fatigue damage ratio, approximate transmissibility, shock amplification, electrical lead wires, chassis resonance, shaker head, slider plate, broadband random vibration, input acceleration level, relative position factor, thermal cycling screen, vibration fatigue life Key Phrases - Capitalized Phrases (CAPs): (learn more)
Substitute Eqs, Item Area, Using Castigliano New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
13
books
cite this book:
See all 13 books citing this book
- Preventing Thermal Cycling and Vibration Failures in Electronic Equipment by Dave S. Steinberg on page 269, and Back Matter
- Accelerated Stress Testing Handbook: Guide for Achieving Quality Products by H. Anthony Chan on page 202, and Back Matter
- Practical Reliability Engineering by Patrick O'Connor on page 285, and page 333
- Improving Product Reliability: Strategies and Implementation (Quality and Reliability Engineering Series) by Mark Levin on page 29, and page 282
- Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability by Michael Pecht on page 335, and page 406
See all 13 books citing this book
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