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4.0 out of 5 stars
Interesting Read,
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This review is from: Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield (Hardcover)
If you need a fast way to get the basics of wirebonding, this book is a straight-forward, very readeable text. It references several papers if you want to read more on a particular section, but does a very good job summarizing available industry data.
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Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield by George G. Harman (Hardcover - June 1, 1997)
Used & New from: $24.00
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