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Product Description
About the Author
Charles A. Harper is a leading authority on electronic circuits and electronic packaging. President of Technology Seminars, Inc., he is past president of the International Microelectronics and Packaging Society (IMAPS), advisory board member for the National Electronics Packaging Conference (NEPCON), and active with the Institute of Electrical and Electronics Engineers (IEEE). A former Johns Hopkins University engineering professor with an esteemed career in industry, he is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and on the editorial advisory board of Electronic Packaging and Production Magazine.
- A guided tour through the new generation of high-performance printed circuit boards (PCBs) and ceramic substrates
- Packed with leading-edge information, including data, details and guidelines on microvias, built-up multi-layers, high-density boards, and advanced ceramic substrates
- Covers environmentally safe PCB materials and processes
- Essential for electronics engineers, designers, and technicians--plus manufacturing and mechanical engineers
About the Author
Charles A. Harper is a leading authority on electronic circuits and electronic packaging. President of Technology Seminars, Inc., he is past president of the International Microelectronics and Packaging Society (IMAPS), advisory board member for the National Electronics Packaging Conference (NEPCON), and active with the Institute of Electrical and Electronics Engineers (IEEE). A former Johns Hopkins University engineering professor with an esteemed career in industry, he is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and on the editorial advisory board of Electronic Packaging and Production Magazine.
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Inside This Book
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First Sentence:
The rapid move toward electronic system miniaturization, which has been driven in large part by consumer electronics, has forced electronic material manufacturers to rethink their approach to the development and marketing of new laminates. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
microvia processes, permanent interconnects, joint fatigue analysis, long ground returns, microvia boards, microvia layers, broadside geometry, conductive filament formation, propagation tear strength, microvia technology, flexible printed wiring boards, printed wiring board industry, adhesiveless laminates, solder float, unfired tape, microvia technologies, soldered interconnects, broadside configuration, broadside approach, resin smear, copper adhesion, bumped die, mezzanine board, printed circuit fabrication, holes conductive Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Environmental Protection Agency, United States, Rogers Corporation, International Symposium, Parameter Value Density, Reliability Physics Symposium, Clean Air Act, Clean Water Act, John Wiley, National Conference, Performance of Advanced, San Jose, Pass Pass Chemical, Printed Wiring Board Case Study, Richard Brown, Analysis of Survey Results, Computer Design, Electronic Materials Handbook, International Microelectronics And Packaging Society, San Diego, San Francisco, Advancing Microelectronics, Ann Arbor, Circuit World New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
The rapid move toward electronic system miniaturization, which has been driven in large part by consumer electronics, has forced electronic material manufacturers to rethink their approach to the development and marketing of new laminates. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
microvia processes, permanent interconnects, joint fatigue analysis, long ground returns, microvia boards, microvia layers, broadside geometry, conductive filament formation, propagation tear strength, microvia technology, flexible printed wiring boards, printed wiring board industry, adhesiveless laminates, solder float, unfired tape, microvia technologies, soldered interconnects, broadside configuration, broadside approach, resin smear, copper adhesion, bumped die, mezzanine board, printed circuit fabrication, holes conductive Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Environmental Protection Agency, United States, Rogers Corporation, International Symposium, Parameter Value Density, Reliability Physics Symposium, Clean Air Act, Clean Water Act, John Wiley, National Conference, Performance of Advanced, San Jose, Pass Pass Chemical, Printed Wiring Board Case Study, Richard Brown, Analysis of Survey Results, Computer Design, Electronic Materials Handbook, International Microelectronics And Packaging Society, San Diego, San Francisco, Advancing Microelectronics, Ann Arbor, Circuit World New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 29
books:
See all 29 books this book cites
10
books
cite this book:
See all 10 books citing this book
- Electronic Packaging and Interconnection Handbook by Charles Harper in Front Matter, page 136, and page 298
- Solders and Soldering: Materials, Design, Production, and Analysis for Reliable Bonding by Howard H. Manko in Front Matter, and page 347
- Final report (CCS occasional paper ; no. 6) by Speyside Project on page 413
- Handbook of Thin Film Technology (McGraw-Hill Handbooks) by Leon I. Maissel on page 190
- Electronic Packaging of High Speed Circuitry by Stephen G. Konsowski on page 136
See all 29 books this book cites
- Electronic Assembly Fabrication by Charles Harper on page 656
- Case Studies in Reliability and Maintenance (Wiley Series in Probability and Statistics) by Wallace R. Blischke on page 185
- Electronic Packaging and Interconnection Handbook by Charles Harper on page 872
- Area Array Packaging Handbook: Manufacturing and Assembly by Ken Gilleo in Front Matter
- Failure Analysis of Engineering Materials by Charles Brooks on page 457
See all 10 books citing this book
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