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Editorial Reviews
Product Description
The wire bonding bible - now revised and expanded! Get the practical know-how you need to design and evaluate wire bonds engineered with the latest - and still-evolving- metallurgies. Extensively revised and updated, the Second Edition of George Harman's classic Wire Bonding in Microelectronics shows you step-by-step how to exploit new higherm density interconnection techniques and engineer reliable gonds at a very high yield. You get the hands-on guidance you need to test wire bonds...clean bond pads to improve bondability and realiability...solve cratering, heel cracks, bond fatigue, so-called purple plague and other mechanical problems....bond wires to multichip modules...and much, much more. You also get up-to-the-minute details on utilizing fine pitch SMT, applying new bonding metallurgies, and exploring wire sweep and the wire bonding mechanism.
From the Back Cover
The classic reference on wire bonding--expanded and updated! Wire Bonding in Microelectronics Second Edition the definitive single-volume reference on wire bonding just got better--in an extensively updated edition with over 100 new pages on new materials, new interconnect techniques such as fine pitch wire bonding, and evaluating the pros and cons of alternative bonding technologies. Wire bonds are used to interconnect integrated circuits, multichip modules and hybrids, and microwave as well as power devices to their packages. The book explains it all, with special emphasis on fine pitch bonding, bonding to MCMs, and additional areas that have been developed since the first edition was published. Readers will learn to: Understand the bonding technology; Test wire bonds; Make reliable bonds at a very high yield; Bond wires to multichip modules; Solve common bonding problems; Evaluate alternative bonding technologies; Improve bondability and reliability via more effective cleaning techniques.
See all Editorial Reviews
The wire bonding bible - now revised and expanded! Get the practical know-how you need to design and evaluate wire bonds engineered with the latest - and still-evolving- metallurgies. Extensively revised and updated, the Second Edition of George Harman's classic Wire Bonding in Microelectronics shows you step-by-step how to exploit new higherm density interconnection techniques and engineer reliable gonds at a very high yield. You get the hands-on guidance you need to test wire bonds...clean bond pads to improve bondability and realiability...solve cratering, heel cracks, bond fatigue, so-called purple plague and other mechanical problems....bond wires to multichip modules...and much, much more. You also get up-to-the-minute details on utilizing fine pitch SMT, applying new bonding metallurgies, and exploring wire sweep and the wire bonding mechanism.
From the Back Cover
The classic reference on wire bonding--expanded and updated! Wire Bonding in Microelectronics Second Edition the definitive single-volume reference on wire bonding just got better--in an extensively updated edition with over 100 new pages on new materials, new interconnect techniques such as fine pitch wire bonding, and evaluating the pros and cons of alternative bonding technologies. Wire bonds are used to interconnect integrated circuits, multichip modules and hybrids, and microwave as well as power devices to their packages. The book explains it all, with special emphasis on fine pitch bonding, bonding to MCMs, and additional areas that have been developed since the first edition was published. Readers will learn to: Understand the bonding technology; Test wire bonds; Make reliable bonds at a very high yield; Bond wires to multichip modules; Solve common bonding problems; Evaluate alternative bonding technologies; Improve bondability and reliability via more effective cleaning techniques.
See all Editorial Reviews
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Inside This Book Citations: This book cites 21 books | 4 books that cite this book Explore: Citations | Books on Related Topics | Concordance | Text Stats Key Phrases - SIPs: bond pull force, bondability problems, machine setup parameters, wire burnout, thermocompression bondability (more) Key Phrases - CAPs: Annual Proc, Reliability Physics, Las Vegas, San Diego, Electronics Components Conf (more) Browse Sample Pages: Front Cover | Copyright | Table of Contents | Excerpt | Index | Back Cover | Surprise Me! |
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Inside This Book
(learn more)
First Sentence:
Currently (1996), there are about 4x1012 wires bonded per year on the planet [IT-1]. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
bond pull force, bondability problems, machine setup parameters, wire burnout, thermocompression bondability, crescent bond, parallel gap welding, wire metallurgy, plating impurities, ball bonding, bond pull test, wedge bonding, ball shear test, outgassed products, wire hardness, wedge bonds, ball bonds, bond reliability, bond heel, wire elongation, bonded ball, pitch bonding, wire sweep, shear probe, thermosonic bonding Key Phrases - Capitalized Phrases (CAPs): (learn more)
Annual Proc, Reliability Physics, Las Vegas, San Diego, Electronics Components Conf, Electronic Components Conf, Solid State Technology, Hybrid Microelectronics, Manufacturing Technology, New York, Los Angeles, San Francisco, Thin Solid Films, New Orleans,
Currently (1996), there are about 4x1012 wires bonded per year on the planet [IT-1]. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
bond pull force, bondability problems, machine setup parameters, wire burnout, thermocompression bondability, crescent bond, parallel gap welding, wire metallurgy, plating impurities, ball bonding, bond pull test, wedge bonding, ball shear test, outgassed products, wire hardness, wedge bonds, ball bonds, bond reliability, bond heel, wire elongation, bonded ball, pitch bonding, wire sweep, shear probe, thermosonic bonding Key Phrases - Capitalized Phrases (CAPs): (learn more)
Annual Proc, Reliability Physics, Las Vegas, San Diego, Electronics Components Conf, Electronic Components Conf, Solid State Technology, Hybrid Microelectronics, Manufacturing Technology, New York, Los Angeles, San Francisco, Thin Solid Films, New Orleans,