Power Integrity Modeling and Design for Semiconductors and Systems (Hardcover)

~ (Author), Ege Engin (Author)

Editorial Reviews

Product Description

The First Comprehensive, Example-Rich Guide to Power Integrity Modeling

Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art.

Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise.

The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications.

The authors

• Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements
• Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more
• Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis
• Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages
• Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures

This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.

About the Author

Madhavan Swaminathan received his B.E. in electronics and communication from Regional Engineering College, Tiruchirapalli, in 1985, and his M.S. and Ph.D. in electrical engineering from Syracuse University in 1989 and 1991. He is currently the Joseph M. Pettit Professor in Electronics in the School of Electrical and Computer Engineering and deputy director of the Packaging Research Center, Georgia Tech. He is also the cofounder of Jacket Micro Devices, a company specializing in RF modules for wireless applications. Before joining Georgia Tech, he worked on packaging for supercomputers for IBM. Swaminathan has written more than 300 publications, holds 15 patents, and has been honored as an IEEE Fellow for his work on power delivery.

A. Ege Engin received his B.S. and M.S. in electrical engineering from Middle East Technical University, Ankara, Turkey, and from the University of Paderborn, Germany. From 2001 to 2004, he was with the Fraunhofer Institute for Reliability and Microintegration in Berlin. During this time, he also received his Ph.D. from the University of Hannover, Germany. He is currently a research engineer in the School of Electrical and Computer Engineering and an assistant research director of the Packaging Research Center at Georgia Tech. He has more than 50 publications in refereed journals and conferences in the areas of signal and power integrity modeling and simulation.

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Product Details

• Hardcover: 496 pages
• Publisher: Prentice Hall PTR; 1 edition (November 29, 2007)
• Language: English
• ISBN-10: 0136152066
• ISBN-13: 978-0136152064
• Product Dimensions: 9.1 x 7.2 x 1.2 inches
• Shipping Weight: 2.2 pounds (View shipping rates and policies)
• Average Customer Review: 5.0 out of 5 stars  See all reviews (2 customer reviews)
• Amazon.com Sales Rank: #507,634 in Books (See Bestsellers in Books)

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• This item is part of The Prentice Hall Modern Semiconductor Design Series Series.

Customer Reviews

Most Helpful Customer Reviews

2 of 2 people found the following review helpful:

5.0 out of 5 stars Foremost and Authoritative book on Power Integrity , June 3, 2008

By	Jayaprakash Balachandran (Sanjose, CA) - See all my reviews (REAL NAME)

Although lot has been written about Signal Integrity (SI), hardly any book is available for Power Integrity (PI) except for research papers. However, recent high speed interfaces such as DDR memories and faster GHz processors pose enormous power integrity challenges. A timely and most authoritative book on this subject is "Power Integrity Modeling and Design for Semiconductors and Systems" by Prof. Madhavan Swaminathan and Dr. Ege Engin of Packaging Research Centre (PRC), Georgia Tech. , USA.

The book captures key results of the power integrity research particularly in the last 5 years and shows how these results can be applied to solve complex off-chip power integrity problems in practice. It also provides in depth understanding of algorithms specifically developed for power integrity model extraction and analysis. Besides R&D, understanding these algorithms and methods would also help to make judicious investments on appropriate tools for power integrity analysis. Analysis of power integrity issues and solutions on some of the leading designs from companies such as Sun Microsystems, IBM and Rambus is of great value addition in this book. What's more, authors also provide a freely downloadable tool developed at PRC, Georgia Tech. for power integrity modeling. Examples discussed in this book can be easily tried with this simulator.

The book is organized in to 5 chapters. The chapter 1 explains the fundamental concepts behind origin, modeling, design and analysis of power integrity effects. It also briefly discusses the techniques for high frequency power-ground impedance measurements. The concepts of self and transfer impedances are also dealt in this chapter. Additionally a methodology for power integrity modeling is presented which forms the basis for subsequent chapters.

The chapter 2 discusses the modeling of power and ground planes with both lumped and distributed circuit approaches. Some of the topics covered are Transmission Matrix Method (TMM), Finite Difference Method (FDM), Finite Difference Time Domain Method (FDTD), Finite Element Method (FEM) and cavity resonators. It also discusses in detail coupling of multiple plane pairs through vias and apertures.

The chapter 3 is all about Simultaneous Switching Noise (SSN). The challenge for SSN analysis is to model complex interaction between transmission lines and plane pairs. A modal decomposition method is introduced for the SSN analysis of plane pairs acting as return path for transmission lines. Applicability of developed SSN model in both time and frequency domains are analyzed. Case study of a complex board analysis using modeling approach developed is also included.

The chapter 4 discusses time domain simulation methods such as rational function method, Signal Flow Graphs (SFG) and Modified Nodal Analysis (MNA). These simulation methods provide time domain waveforms from frequency response captured through S-parameters or other equivalent parameters. The results derived in this chapter show why co-simulation of signal and power integrity effects is required and how this can be done using the simulation methods described. The importance of causality and passivity enforcement are illustrated through practical examples. The various time domain simulation methods are also compared.

The chapter 5 provides case studies of power integrity issues in packages and PCBs in leading industrial designs. Other topics covered are test structures for extraction of material properties, embedded decoupling capacitors and Electronic Band Gap (EBG) structures. Accurate extraction of dielectric material properties such as loss tangent and dielectric constant is essential for accurate power and signal integrity modeling. This material property extraction is always a challenge. The authors however describe a simple yet powerful test setup to accurately extract material properties for broad range of frequencies. Embedded decoupling capacitors are an emerging technology to suppress power supply noise and this is dealt in detail. The EBGs are a novel passive filter structure exploited to provide power supply noise isolation between sensitive analog blocks (ex. LNAs, ADC) and noisy digital circuits. This chapter provides an excellent understanding of modeling and design methods for EBG structures with practical examples.

The methods described in the above chapters were validated using a combination of measurements and full wave EM solver analysis. The book also provides complete details on the fabricated test structures for validation. Figures that illustrate the concepts in this book are so captivating that they more or less need no explanation. Although this book provides a complete picture of power integrity like that of a text book it lacks student problems to reinforce understanding. Nevertheless this is an invaluable book for students stepping in to the world of signal and power integrity, experienced professionals involved in high speed design and for all those developing signal and power integrity tools.

4 of 5 people found the following review helpful:

5.0 out of 5 stars Great book covering the power integrity issue of package, April 25, 2008

By	M. C. Chen (Taipei, Taiwan) - See all my reviews

At first, I was looking for a book covering on-chip power integrity issue and happened to find this book on Amazon. Since I can not search inside this book, I just bought it and later found it is related to the power integrity of package, not chip. However, I DEFINITELY don't regret buying this book because it covers one of the important pieces in the design of power distribution network.

After reading chapter 1, I realize that the power integrity issue should be attacked from a system point of view, including chip, package and board. Only considering on-chip power integrity is not enough because the power supply is located on the board and electrically far away from the chip. The important concept of target impedance is also introduced and really opens my mind on how to design a robust power distribution network.

Chapter 2 covers the modeling of power/ground planes in high performance package and board. Two novel modeling methods, transmission matrix method and cavity-model method are desrcibed in detail here. The major advantages of the two methods over full wave methods, like FDTD and FEM, are ease of integrating into circuit simulators.

Chapter 3 covers the topic of simultaneous switching noises. The signal nets are modeled as uncoupled microstrip and strip transmission lines. The coupling effects between signals and power/ground planes are modeled as controlled sources, which are obtained by mode decomposistion methods. Then, the uncoupled transmission lines and controlled sources are integrated with the power/ground plane models from chapter 2 to conduct simultaneous switching noise analysis.

Chapter 4 introduces time-domain simulations of power distribution networks. The major foucs is how to incorporate s-parameter data into time-domain circuit simulators. The techniques like vetor fitting, passivitiy enforcement by Hamiltonian matrix , signal flow method, and MNA with s-parameter are explained and compared.

Chapter 5 applies the modeling and analysis methods from previous chapters to real applications. Great insight is learned from these real world problems.

I strongly recommend this book to the designers and CAD tool developers of power distribution networks. Since the major focus of this book is package power, I also recommend two other books which cover board and on-chip power integirty issue respectively:

"Frequency-Domain Characterization of Power Distribution Networks" by Istvan Novak and Jason R. Miller

"Power Distribution Networks with On-Chip Decoupling Capacitors" by Mikhail Popovich, Andrey V. Mezhiba, and Eby G. Friedman