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Plasma Etching: Fundamentals and Applications (Series on Semiconductor Science and Technology, 7)
 
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Plasma Etching: Fundamentals and Applications (Series on Semiconductor Science and Technology, 7) (Hardcover)

~ (Author), Barry L. Stansfield (Contributor), S. Handa (Contributor), K. Fujita (Contributor), S. Watanabe (Contributor), T. Tsukamoto (Contributor)
5.0 out of 5 stars  See all reviews (2 customer reviews)

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  • This item: Plasma Etching: Fundamentals and Applications (Series on Semiconductor Science and Technology, 7) by M. Sugawara

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Product Description

This book focuses on the remarkable recent advances in understanding low pressure radio frequency glow discharges. It explains the basic analytical theory, plasma physics, and plasma diagnostics, before proceeding to the details of the etching process.


About the Author

Professor Minoru Sugawara, Hachinohe Institute of Technology, Hachinohe-city, Aomori 031, Japan. Fax: (0) 178 25 1430

Product Details

  • Hardcover: 362 pages
  • Publisher: Oxford University Press, USA; illustrated edition edition (July 30, 1998)
  • Language: English
  • ISBN-10: 019856287X
  • ISBN-13: 978-0198562870
  • Product Dimensions: 9.3 x 6.1 x 1.1 inches
  • Shipping Weight: 1.4 pounds (View shipping rates and policies)
  • Average Customer Review: 5.0 out of 5 stars  See all reviews (2 customer reviews)
  • Amazon.com Sales Rank: #1,942,558 in Books (See Bestsellers in Books)

    Popular in this category: (What's this?)

    #41 in  Books > Science > Physics > Solid-State Physics > Plasma Physics

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M. Sugawara
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1 of 1 people found the following review helpful:
5.0 out of 5 stars ECR Plasma Etching, May 17, 2001
By A Customer
One of the only books available that contain theoretical and practicle information on ECR etching. A must for any etch engineers working in the semiconductor industry.
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1 of 1 people found the following review helpful:
5.0 out of 5 stars understanding plasma processes, December 28, 2000
By A Customer
Gives a detailed physical understanding on the fundamentals of plasma processes including Inductively Coupled Plasma and current advancements in etching processes.
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