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Microelectronics Packaging Handbook, Part II: Semiconductor Packaging (Pt. 1) (Hardcover)

by R.R. Tummala (Author), Eugene J. Rymaszewski (Author), Alan G. Klopfenstein (Author)
Key Phrases: ionic bonded type, bond squash, projection laser ablation, New York, Components Hybrids Manuf, United States (more...)

5.0 out of 5 stars See all reviews (1 customer review)

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Product Description
This thoroughly revised and updated three volume set continues to be the standard reference in the filed, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fat microcircuitry.

Product Details

Hardcover: 1030 pages
Publisher: Springer; 2nd edition (January 31, 1997)
Language: English
ISBN-10: 0412084414
ISBN-13: 978-0412084416
Product Dimensions: 9.2 x 6.5 x 2.3 inches
Shipping Weight: 3.4 pounds

Average Customer Review: 5.0 out of 5 stars See all reviews (1 customer review)

Amazon.com Sales Rank: #2,150,962 in Books (See Bestsellers in Books)

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Inside This Book (learn more)

Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
ionic bonded type, bond squash, projection laser ablation, wirebonded packages, wirebonding process, capacitance testing, rapid thermal curing, crescent bond, subtractive etching, surface laminar circuitry, amic alkyl ester, multilevel thin films, photosensitive polyimide precursor, nonhermetic packages, defective nets, wiring definition, wiring density, nonhermetic packaging, additive electroplating, bumped tape, electron beam testing, lead bonder, ceramic packaging, inner lead bonding, wire sweep

Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Components Hybrids Manuf, United States, Year Figure, Georgia Tech, International Test Conference, Package Reliability, Epoxy Silver, International Conference, Proceedings Second International, Electronic Components Conference Proceedings, Proceedings Fourth International, Solid State Technol, Van Nostrand Reinhold, National Semiconductor, Advanced Packaging Symposium, Processor Group, Texas Instruments, Ciba Geigy, Microelectronics Packaging-An Overview, Polymer Eng, Nitto Denko, Polymer Sci, Bell Laboratories, Georgia Institute of Technology

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5.0 out of 5 stars Better than Godot., August 13, 1999

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I was not able to review this book because it is not available. However, it is such a good book that the anticipation of its arrival is better than Waiting for Godot.