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Failure Modes And Mechanisms In Electronic Packages (Hardcover)

by P. Singh (Author), Puligandla Viswanadham (Author) "Developments in the semiconductor industry, along with consumer demand for cheaper, lighter, high-density information processing tools, have in effect revolutionized the entire electronic packaging infrastructure..." (more)
Key Phrases: printed circuit carrier, solder ball formation, solder joint voids, New York, Reliability Physics, Circuit World (more...)
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Product Description
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and the prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers, and PCB assemblies.

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Inside This Book (learn more)
First Sentence:
Developments in the semiconductor industry, along with consumer demand for cheaper, lighter, high-density information processing tools, have in effect revolutionized the entire electronic packaging infrastructure. Read the first page
Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
printed circuit carrier, solder ball formation, solder joint voids, copper discontinuity, solder mask surface, plating voids, wave solder process, epoxy smear, fretting mechanism, elastomeric connectors, fine pitch surface mount technology, solder balling, surface insulation resistance, solder particles, connector reliability, gold intermetallics, solder joint reliability, insertion mount, connector failures, copper migration, reflow process, contact reliability, silver migration, whisker growth, solder joint failures
Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Reliability Physics, Circuit World, Van Nostrand Reinhold, Annual Proceedings, John Wiley, Texas Instruments Inc, American Society of Metals, Metals Park, San Francisco, Suggested Readings, Advanced Packaging, Buehler Ltd, Circuits Assembly, Connection Technology, Las Vegas, Metal Digest, Packages Figure, Printed Circuit Fabrication, Applied Life Data Analysis, Circuits Manufacturing, Instrumental Methods of Analysis, Journal of the Electrochemical Society, Prototype Built, Sanders Road
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