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Offers contributions from a wide array of experts who address areas covering the most advanced research and solutions in COB and MCM today. DLC: Electronic packaging.
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Chip On Board: Technology for Multichip Modules
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Inside This Book
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First Sentence:
The major trend in the electronics industry today is to make products more personal by making them lighter, smaller, thinner, shorter, and faster, while at the same time making them more friendly, functional, powerful, reliable, and less expensive.1-42 Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
wire bond pull test, ball bond shear strength, reflow gang, automated bonding process, solder bump structure, aluminum bump, destructive pull testing, quasi module, ball bond shear test, bond nugget, micron bump bonding method, typical manufacturing process flow, bonder manufacturer, test fault coverage, polymerization stress, temporary packaging, solder bumped flip chip, bump deformation, thermocompression bonding process, underfill encapsulation, yielded chips, lead bonding process, mean shear strength, wire bond pull strength, copper bumps Key Phrases - Capitalized Phrases (CAPs): (learn more)
Technology Conference, New York, Van Nostrand Reinhold, Electronic Components Conference, Solid State Technology, Tester Model, International Electronics Packaging Conference, Circuit World, International Manufacturing Technology Symposium, John Wiley, Square Chip Size, Test Conf, Electrochemical Publications, Token Ring, Board Figure, Academic Press, Ceramic Epoxy, Electronic Materials Handbook, Electronic Test, Far East, Journal of Electronic Materials, Materials Park, Semiconductor International, Ceramic None, International Electronic Manufacturing Technology Symposium New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
The major trend in the electronics industry today is to make products more personal by making them lighter, smaller, thinner, shorter, and faster, while at the same time making them more friendly, functional, powerful, reliable, and less expensive.1-42 Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
wire bond pull test, ball bond shear strength, reflow gang, automated bonding process, solder bump structure, aluminum bump, destructive pull testing, quasi module, ball bond shear test, bond nugget, micron bump bonding method, typical manufacturing process flow, bonder manufacturer, test fault coverage, polymerization stress, temporary packaging, solder bumped flip chip, bump deformation, thermocompression bonding process, underfill encapsulation, yielded chips, lead bonding process, mean shear strength, wire bond pull strength, copper bumps Key Phrases - Capitalized Phrases (CAPs): (learn more)
Technology Conference, New York, Van Nostrand Reinhold, Electronic Components Conference, Solid State Technology, Tester Model, International Electronics Packaging Conference, Circuit World, International Manufacturing Technology Symposium, John Wiley, Square Chip Size, Test Conf, Electrochemical Publications, Token Ring, Board Figure, Academic Press, Ceramic Epoxy, Electronic Materials Handbook, Electronic Test, Far East, Journal of Electronic Materials, Materials Park, Semiconductor International, Ceramic None, International Electronic Manufacturing Technology Symposium New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 45
books:
See all 45 books this book cites
1
book
cites this book:
- Microelectronics Packaging Handbook by R.R. Tummala on 4 pages
- Handbook Of Tape Automated Bonding by John H. Lau on 4 pages
- Electronic Packaging by K.A. Jackson on 4 pages
- Principles of Electronic Packaging by Donald Seraphim on page 87, page 98, and page 272
- Surface Mount Technology - Principles and practice, Second Edition by Ray Prasad on page 88, and page 408
See all 45 books this book cites
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