Principles of Plasma Discharges and Materials Processing (Hardcover)

by Michael A. Lieberman (Author), Allan J. Lichtenberg (Author) "The plasma medium is complicated in that the charged particles are both affected by external electric and magnetic fields and contributes to them..." (more)
Key Phrases: Academic Press, Physics of Thin Films, Monte Carlo

Editorial Reviews

Review
"The authors have done an excellent job…this is a good book for an academic course that will provide the foundation to senior-level and graduate students…" (MRS Bulletin, November2005) --This text refers to the Hardcover edition.

Product Description
Timely, authoritative, pedagogically consistent— a valuable professional resource and a superior didactic tool. Authored by two internationally respected pioneers in the field, this book offers a fully integrated, pedagogically consistent presentation of the fundamental physics and chemistry of partially ionized, chemically reactive, low-pressure plasmas and their roles in a wide range of plasma discharges and processes used in thin film processing applications—especially in the fabrication of integrated circuits. With many fully worked examples, practice exercises, and clear demonstrations of the relationship of plasma parameters to external control parameters and processing results, this book combines the best qualities of a student text and a professional resource.

• In-depth coverage of the fundamentals of plasma physics and chemistry—includes separate chapters on atomic and molecular collisions
• Applies basic theory to plasma discharges, including calculations of plasma parameters and scaling of plasma parameters with control parameters
• Applies results to basic processing mechanisms and the effects of plasma parameters on those mechanisms
• Uses numerous worked examples to demonstrate the relationships between control parameters, plasma parameters, and processing results

See all Editorial Reviews

Product Details

• Hardcover: 600 pages
• Publisher: Wiley-Interscience; 1 edition (October 14, 1994)
• Language: English
• ISBN-10: 0471005770
• ISBN-13: 978-0471005773
• Product Dimensions: 9.6 x 6.5 x 1.3 inches
• Shipping Weight: 2.3 pounds
• Average Customer Review: 4.2 out of 5 stars See all reviews (5 customer reviews)
• Amazon.com Sales Rank: #887,531 in Books (See Bestsellers in Books)

  Popular in these categories: (What's this?)

  #6 in	Books > Science > Chemistry > Surface Chemistry
  #8 in	Books > Science > Physics > Solid-State Physics > Plasma Physics
  #66 in	Books > Professional & Technical > Engineering > Materials Science > Extraction & Processing

Customer Reviews

Most Helpful Customer Reviews

4 of 4 people found the following review helpful:

5.0 out of 5 stars outstanding plasma resource, January 15, 2007

By	D. Berisford - See all my reviews (REAL NAME)

This review is from: Principles of Plasma Discharges and Materials Processing , 2nd Edition (Hardcover)

One of the most practical and comprehensive resources on plasma phyics and engineering. The book is much easier to understand and more in depth than most other books on the subject, except for maybe chen (who takes more of a physics approach, whereas lieberman takes more of an engineering approach) This book is a must have for anyone working with or studying plasmas.

14 of 19 people found the following review helpful:

1.0 out of 5 stars Overrated, May 4, 2000

By	PECVD Engineer (Silicon Valley) - See all my reviews

As a praciticing process engineer my opinion is this book lacks insight. Typical text book written a professor in the academic community with no practical experience. This book spends far to much time deriving equations and not discussing the basics concepts. The author makes a half hearted attempt to relate the first 14 chapters to the real worl, in a short and inadequate Chapter 15. This is the first mail book order book i took the time to return. In all honesty this book is not worth the $90.00. Spend your money elsewhere

3 of 6 people found the following review helpful:

5.0 out of 5 stars Very Good Theoretical Coverage of Plasma's, including ECR, May 1, 1998

By	Craig Kuhl "Craig" (California, USA) - See all my reviews (REAL NAME)

This book provides a theoretical overview of plasma's, including coverage of ECR applications. This was very valuable for Hitachi Etchers. The theory is presented at an undergraduate level and assumes the reader has knowledge of vector analysis. Highly recommended for any Etch Process Engineer in the Semiconductor Industry.