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Fundamentals of Electrochemical Deposition (The ECS Series of Texts and Monographs) (Hardcover)

by Milan Paunovic (Author), Mordechay Schlesinger (Author) "Electrochemical deposition of metals and alloys involves the reduction of metal ions from aqueous, organic, and fused-salt electrolytes..." (more)
Key Phrases: displacement deposition, geometric leveling, anodic partial reaction, New York, Electrochemical Society, Plenum Press (more...)

4.5 out of 5 stars See all reviews (2 customer reviews)

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Editorial Reviews

Review
"...an excellent teaching and resource material...it is concise, coherently structures, and easy to read...highly recommended for students, engineers, and researchers in all related fields." (Corrosion, January 2003)

Product Description
A comprehensive introduction to one of today's most exciting & rapidly evolving fields of practical knowledge in electrochemical deposition. DLC: Electroplating.

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Product Details

Hardcover: 312 pages
Publisher: Wiley-Interscience (October 15, 1998)
Language: English
ISBN-10: 0471168203
ISBN-13: 978-0471168201
Product Dimensions: 9.6 x 6 x 0.8 inches
Shipping Weight: 1.2 pounds

Average Customer Review: 4.5 out of 5 stars See all reviews (2 customer reviews)

Amazon.com Sales Rank: #1,515,136 in Books (See Bestsellers in Books)
Popular in this category: (What's this?)
#90 in Books > Science > Chemistry > Physical & Theoretical > Electrochemistry

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Inside This Book (learn more)

First Sentence:
Electrochemical deposition of metals and alloys involves the reduction of metal ions from aqueous, organic, and fused-salt electrolytes. Read the first page

Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
displacement deposition, geometric leveling, anodic partial reaction, catalytic nuclei, electroless copper deposition, cathodic partial reaction, progressive nucleation, coherent deposit, electroless deposition, electroless metal deposition, alloy deposition, electrodeposited metals, partial current density, cathode efficiency, electrodeposited nickel, test electrode, throwing power, mixed potential, electrochemical model, instantaneous nucleation, electrochemical deposition, electrodeposition process, limiting current density, multilayer growth, columnar microstructure

Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Electrochemical Society, Plenum Press, Academic Press, Faraday Soc, Electrochemically Deposited Thin Films, Oxford University Press, Interscience Publishers, Modern Electroplating, Advanced Treatise, Comprehensive Treatise of Electrochemistry, Noyes Publications, Surface Electrochemistry, Dover Publications, Solid State Physics, Statistical Thermodynamics, Theoretical Foundations, University of Windsor

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Citations (learn more)

This book cites 54 books:

Advances in Electrochemistry and Electrochemical Engineering (Advances in Electrochemistry & Electrochemical Engineering) by Paul Delahay on 6 pages
Modern Electrochemistry by John O. Bockris on 4 pages
Modern Electrochemistry: An Introduction to an Interdisciplinary Area, Vol. 1 by John O'M. Bockris on 4 pages
Electrochemical Phase Formation and Growth by E. Budevski on page 100, page 118, and page 131
Solid State Physics: Advances in Research and Applications, Vol. 32 by Henry Ehrenreich on page 38, page 261, and Back Matter

See all 54 books this book cites

7 books cite this book:

Microelectronic Packaging (New Trends in Electrochemical Technology) by M. Datta on page 296, and page 509
Fundamentals of Electrochemistry (The ECS Series of Texts and Monographs) by Vladimir S. Bagotsky on page 317
SemiConductor Wafer Bonding: Science and Technology by Q.-Y. Tong in Front Matter
Chemical Physics of Thin Film Deposition Processes for Micro- and Nano-Technologies (NATO Science Series II: Mathematics, Physics and Chemistry) by Y. Pauleau on page 17
Atmospheric Corrosion by Christofer Leygraf in Front Matter

See all 7 books citing this book

Books on Related Topics (learn more)

Modern Electroplating, 4th Edition by Mordechay Schlesinger PhD

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Electrodeposition by Jack W. Dini

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Crystal Growth for Beginners by Ivan V. Markov

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Electroplating by Nasser Kanani

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What Do Customers Ultimately Buy After Viewing This Item?

	74% buy the item featured on this page: Fundamentals of Electrochemical Deposition (The ECS Series of Texts and Monographs) 4.5 out of 5 stars (2)
	11% buy Electroplating: Basic Principles, Processes and Practice $216.00
	10% buy Modern Electroplating, 4th Edition 4.5 out of 5 stars (2) $196.00
	5% buy The Chemical Analysis of Electroplating Solutions 4.0 out of 5 stars (1) $60.00

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Customer Reviews

2 Reviews

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Average Customer Review

4.5 out of 5 stars (2 customer reviews)

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Most Helpful Customer Reviews

5.0 out of 5 stars Excellent, May 25, 2001

By A Customer

The book covers the major features of all kinds of electrochemical deposition and it is a handy book for all those involved in this kind of depostion studies..

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0 of 1 people found the following review helpful:

4.0 out of 5 stars Electrochemical Deposition, May 26, 2001

By A Customer

This book being the first of its kind in the industry on electrochemical deposition is very informative and interesting. Copper damanscene being the future for CMP has somwhat made this book a neccessity to all personnel working in the micro electronics industry.

The book gives a good grounding on electrochemical deposition and the underlying parameters that affect deposition.

The only setback is that there is no effort being made to link the findings in the deposition of copper and how it affects the final CMP process.

Being a new and first of its kind this is forgivable.

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