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This volume provides a comprehensive state-of-the art assessment of the fundamentals of the Microscale heat transfer and transport phenomena and heat transfer and applications in Microsystems. The modern trend toward miniaturization of devices requires a better understanding of heat mass transfer phenomena in small dimensions. Devices having dimensions of order of microns are being developed for use of cooling of integrated circuits, and in biochemicals-biomedical applications and cryogenics. Microelectromechanical systems (MEMS) have an important impact in medicine, bioengineering, information technologies and other industries.
This volume provides a comprehensive state-of-the art assessment of the fundamentals of the Microscale heat transfer and transport phenomena and heat transfer and applications in Microsystems. The modern trend toward miniaturization of devices requires a better understanding of heat mass transfer phenomena in small dimensions. Devices having dimensions of order of microns are being developed for use of cooling of integrated circuits, and in biochemicals-biomedical applications and cryogenics. Microelectromechanical systems (MEMS) have an important impact in medicine, bioengineering, information technologies and other industries.
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wavy flow regime, dimensionless average temperature, high flux electronics, parallel plate micro channel, uniform temperature boundary condition, cryogenic catheters, flow boiling heat transfer, copper sintered powder wick, harsh environment electronics, miniature heat pipes, vapour quality, exchanger ineffectiveness, heat pipe condenser, pool boiling critical heat flux, solid sorption cooler, hydraulic diameter decreases, regenerative cryocoolers, microchannel tubes, microscale boiling, thermal management technologies, microscale heat transfer, pool boiling heat transfer, damage threshold fluence, carrier number density, uniform heat flux boundary conditions Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Heat Mass Transfer, Mechanical Engineering, Physical Review, New Orleans, Academic Press, Rio de Janeiro, International Conference, Lithium Bromide, International Journal of Multiphase Flow, College Park, Los Angeles, Molecular Dynamics Study, Winter Meeting, Cryogenic Engineering, International Heat Pipe Conference, International Journal of Refrigeration, Analytical Chemistry, Applied Physics Letters, Applied Thermal Engineering, Journal of Fluid Mechanics, Microscale Energy Transport, Plenum Press, University of Miami, Colloid Interface Sci New!
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wavy flow regime, dimensionless average temperature, high flux electronics, parallel plate micro channel, uniform temperature boundary condition, cryogenic catheters, flow boiling heat transfer, copper sintered powder wick, harsh environment electronics, miniature heat pipes, vapour quality, exchanger ineffectiveness, heat pipe condenser, pool boiling critical heat flux, solid sorption cooler, hydraulic diameter decreases, regenerative cryocoolers, microchannel tubes, microscale boiling, thermal management technologies, microscale heat transfer, pool boiling heat transfer, damage threshold fluence, carrier number density, uniform heat flux boundary conditions Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Heat Mass Transfer, Mechanical Engineering, Physical Review, New Orleans, Academic Press, Rio de Janeiro, International Conference, Lithium Bromide, International Journal of Multiphase Flow, College Park, Los Angeles, Molecular Dynamics Study, Winter Meeting, Cryogenic Engineering, International Heat Pipe Conference, International Journal of Refrigeration, Analytical Chemistry, Applied Physics Letters, Applied Thermal Engineering, Journal of Fluid Mechanics, Microscale Energy Transport, Plenum Press, University of Miami, Colloid Interface Sci New!
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Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
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This book cites 48
books:
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- Mass Transfer by Anthony F. Mills on page 47, page 254, and page 336
- Convective Heat Transfer: Second Edition by Sadik Kakac on page 22, page 90, and page 195
- Computer Simulation of Liquids by M. P. Allen on page 377, and page 400
- Heat and Mass Transfer by H. D. Baehr on page 272, and page 442
- Advances in Thermal Modeling of Electronic Components and Systems (Asme Press) by Avram Bar-Cohen on page 336, and page 497
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