Book Description
Paperback. This book deals with recent progress in the analysis of macro and microscale heat transfer, cooling techniques and thermally induced failures in electronic systems. The field covers microelectronic, power electronic, opto-electronic, etc. Analysis focuses on systems and component levels as well as integrated circuits, multichip modules, high density packages, sensors, card. The papers deal with: Thermal management in optimal design / Thermal characterization and measurement techniques / Analytical and computational thermal modelling / Single and multiphase convective cooling / Applications of new materials in thermal management / Thermal reliability / Thermal problems in material and package processing.
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