Product Description
This text, though primarily concerned with the properties and structure of resistors and capacitors, also provides a comprehensive general introduction to the electronic properties of materials used in the manufacture of electronic components. Coverage includes the band theory of materials and the conduction mechanisms in metals, dielectrics and other structures. The manufacture, structure and properties of fixed and variable resistors and capacitors are discussed in detail. Also included are non-linear components such as NTC and PTC thermistors, strain gauges, pressure transducers, varistors and sensors. The text concludes with a chapter on the quality and reliability of electronic devices with practical values of field reliability performance quoted.
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First Sentence:
The aim of this book is to give both an analytical and practical guide to resistive and capacitive components. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
wattage dissipation, wet tantalum, wet aluminium, metal foil resistors, sintered aluminium, resistor diffusion, resistor technology, wet electrolyte, reconstituted mica, forbidden band gap, metal glaze, solid tantalum capacitors, derating curves, tantalum foil, conducting plastic, air abrasion, metal islands, voltage coefficient, foil electrodes, film resistors, electrolytic capacitors, working voltage, capacitor types, temperature coefficient, electron mean free path Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Market Usage, Solid Aluminium, British Standard, Ceramic Low, Elsevier Advanced Technology, Western Europe, Year Book of World Electronics Data, Solid State, Thick Film Hybrid Microelectronics, Academic Press, Asia-Pacific Edition, Benn Publications, Component Type Failure Rate, Metallised Paper, Multilayer Ceramic High, Potentiometer Output Ratio, Resistance Band, Summary Table New!
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Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
The aim of this book is to give both an analytical and practical guide to resistive and capacitive components. Read the first page Key Phrases - Statistically Improbable Phrases (SIPs): (learn more)
wattage dissipation, wet tantalum, wet aluminium, metal foil resistors, sintered aluminium, resistor diffusion, resistor technology, wet electrolyte, reconstituted mica, forbidden band gap, metal glaze, solid tantalum capacitors, derating curves, tantalum foil, conducting plastic, air abrasion, metal islands, voltage coefficient, foil electrodes, film resistors, electrolytic capacitors, working voltage, capacitor types, temperature coefficient, electron mean free path Key Phrases - Capitalized Phrases (CAPs): (learn more)
New York, Market Usage, Solid Aluminium, British Standard, Ceramic Low, Elsevier Advanced Technology, Western Europe, Year Book of World Electronics Data, Solid State, Thick Film Hybrid Microelectronics, Academic Press, Asia-Pacific Edition, Benn Publications, Component Type Failure Rate, Metallised Paper, Multilayer Ceramic High, Potentiometer Output Ratio, Resistance Band, Summary Table New!
Books on Related Topics | Concordance | Text Stats Browse Sample Pages:
Front Cover | Table of Contents | First Pages | Index | Back Cover | Surprise Me!
Citations (learn more)
This book cites 29
books:
See all 29 books this book cites
3
books
cite this book:
- Handbook of Thin Film Technology (McGraw-Hill Handbooks) by Leon I. Maissel on 4 pages
- Electronic Properties of Materials by Rolf E. Hummel on page 20, page 41, and page 77
- Theory of Metals by Wilson on page 77, and page 116
- Electronic devices and components by J Seymour on page 116, and page 208
- The Theory of the Properties of Metals and Alloys by Neville F. Mott on page 92, and page 116
See all 29 books this book cites
- The Physical Properties of Thin Metal Films (Electro Component Science Monographs) by G.P. Zhigal'skii in Front Matter
- Handbook of Thick- and Thin-Film Hybrid Microelectronics by Tapan K. Gupta on page 121
- Passive Electronic Component Handbook by Charles A. Harper on page 67
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