Land patterns for BGA packages: routing, spacing and soldermask requirements for coarse- and fine-pitch ball grid arrays.(BGA Footprints): An article from: Printed Circuit Design & Manufacture [HTML] (Digital)

~ Vern Solberg (Author)

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This digital document is an article from Printed Circuit Design & Manufacture, published by UP Media Group, Inc. on May 1, 2004. The length of the article is 1294 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.

Citation Details
Title: Land patterns for BGA packages: routing, spacing and soldermask requirements for coarse- and fine-pitch ball grid arrays.(BGA Footprints)
Author: Vern Solberg
Publication: Printed Circuit Design & Manufacture (Magazine/Journal)
Date: May 1, 2004
Publisher: UP Media Group, Inc.
Volume: 21 Issue: 5 Page: 30(3)

Distributed by Thomson Gale

Product Details

• Format: HTML
• Printable: Yes
• Mac OS Compatible: Yes
• Windows Compatible: Yes
• Handheld Compatible: Yes
• File Size: 9 KB
• Digital: 5 pages
• Publisher: UP Media Group, Inc. (July 31, 2005)
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• Amazon.com Sales Rank: #6,129,166 in Books (See Bestsellers in Books)
• Required Free Software: Any web browser