Cooler Master High Performance Thermal Paste - (HTK-002-U1)

Other products by Cooler Master

Product Details

• Product Dimensions: 3 x 0.5 x 5 inches ; 8 ounces
• Shipping Weight: 1 pounds (View shipping rates and policies)
• Shipping: Currently, item can be shipped only within the U.S.
• ASIN: B0009PTBZ6
• Item model number: HTK-002-U1
• Average Customer Review: 3.3 out of 5 stars  See all reviews (3 customer reviews)
• Amazon.com Sales Rank

  Popular in this category: (What's this?)

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  Electronics > Computers & Accessories > Internal Desktop Components > CPU Coolers

• Date first available at Amazon.com: April 2, 2004

Product Description

From the Manufacturer

From the Manufacturer

Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

PRODUCT FEATURES

- Suitable for CPU, chipsets on Mainboard, VGA card, etc. - Easy to use. - Zif Socket Templates ensure correct applying area with various CPU socket types. - Produces an even layer when using applicator. - Dielectric. - Wide range of application temperature.

PRODUCT SPECIFICATIONS

Model	HTK-002-U1
Color	White
Specific Gravity	2.37
Viscosity/Flowability	Nonflowing
Shelf Life	24 months from DOM
Thermal Conductivity	0.8 watts/meter- °C
Volume Resistivity	5.0 x 1015
Dielectric Constant	4.4 at 100k Hz
Dissipation Factor	0.02 at 100k Hz
Dielectric Strength	550 volts/mil; 21.7 kV/mm

Product Description

Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

Customer Reviews

Most Helpful Customer Reviews

1.0 out of 5 stars Temperature Raised instead of be reduced (both AMD and intel), June 11, 2009

By	AutoMan (Miami) - See all my reviews

I tried this product in both AMD Athlon and Intel P3 processors without success.
15 degrees up!.After removed this sticky paste from my fan sinks all went OK again.

4.0 out of 5 stars Good at what it does, May 31, 2009

By	kajmal - See all my reviews

The little strip of thermal paste that came with a replacement heat sink for my laptop was garbage. The old cooling fan burned out because it was running overtime. The replacement fan was still running at top speed whenever it was on, so I ordered this. The CPU is now running substantially cooler. Before, the air coming out of the back of the laptop was just a bit warm, now that the heat is being transferred to the heat sink properly, it feels much hotter. The only problem I found was that there was no included template for laptops, so I had to make my own. Not a big deal, just a bit of a pain.

5.0 out of 5 stars Lower temperture, April 21, 2009

By	Lord "Lord racer" (Wisconsin, USA) - See all my reviews

I got like a 10 degree lower temperture... A5 is good but this product has a good price and works fine!